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Variable Modular Concept

The MH70R is not a single standard product, it is rather a modular concept, which is available within a project context and therefore very flexible for use in various applications.

Main Server Unit and Centralized Platform

The MH70R main server unit acts as the central component of the railway data center. Several distributed functions are combined into a centralized platform, which reduces the amount of devices within the application environment.

Railway Data Center

The railway data center is the mobile office IT computer for virtually all non-vital train applications, e.g., PIS, media streaming, onboard internet or diagnosis server. It is a general purpose, modular platform. The hardware is solely based on standard technologies, supporting a flexible and scalable configuration of the end system with plug-and-play wireless communication channels, storage extensions, connectivity to other train computers, or I/O interfaces to sensors and actuators. Another standard system offered as part of a railway data center is, e.g., the MH70S data storage system.

High-Performance CPU, Virtualization and Security

The system is based on a high-performance Intel Xeon-D processor. Being an open virtualization platform, it supports Intel VT-x and VT-d technology to virtualize several functions, e.g., video surveillance or ticketing. The software can be developed without hardware which reduces the development time. It also supports a Trusted Platform Module (TPM) for security implemented through cryptography, as well as an error-correcting code (ECC) memory, board and system management control, and a watchdog timer to ensure reliability.

Modular Design

Based on a modular 40 HP CompactPCI Serial system, the MH70R can be wall or rack-mounted and offers a multitude of configuration possibilities resulting in a fast time-to-market.

For the concept, a high-performance, high-bandwidth multi-core CPU board offering 10 Gigabit and Gigabit Ethernet interfaces, legacy serial I/O such as RS232, and USB 3.0 interfaces is available. The most common wireless communication functions can be implemented in the MH70R via CompactPCI Serial peripheral boards, as well as hot-pluggable and easy to exchange HDD/SSD shuttles which allow easy maintenance in the field.

The system is cooled by using an additional fan tray at the bottom of the system. Cooling is independent of the mounting position.

Designed for Harsh Environments

The GX1 offers a cost-effective PCIe Gen 3 switching solution via the CompactPCI Serial backplane. It comes with Express Switch or Express Fabric functionality. Some typical industrial applications include multi-CPU high speed video and image processing, supercomputing and virtualization. The GX1’s final configuration depends on the end application. It is only available within a project context and cannot be ordered as a single standard product.

High-Speed Connection

The GX1 enables high speed serial point-to-point communication between the CPUs and between the CPUs and end point modules. Configurable data transfer rates can reach up to 985 MB/s per PCIe lane.

Flexible Configuration of Multi-Processor Systems

The switch allows connection of multiple endpoints and multiple CPUs. This way, it is possible to build powerful and cost-effective multi-processor systems. The switch ports can be configured flexibly using an application running on the root complex CPU. This way, the switch can be adapted to different backplane designs. No programming is required to set up the ports. Setup and diagnostics tools are available from the chip manufacturer.

Express Switch Functionality

The GX1 supports both multi-root and multi-host configuration. For multi-root configuration, the GX1 can be partitioned into four fixed virtual bridges supporting up to four root complexes. Each root complex is allowed to enumerate its own endpoints. Non-transparent bridging is not required in this case. For multi-host configuration, the primary host CPU is acting as a root complex enumerating all the endpoints and up to two additional secondary host CPUs connected over two non-transparent bridges. In this configuration, all host CPUs are able to communicate with all endpoints. Using the non-transparent bridging the primary CPU is able to share control, status and interrupt information with the secondary hosts. This allows more efficient load sharing in data intensive computing applications.

Express Fabric Functionality

GX1 can also be equipped with an Express Fabric chip which is especially suitable for complex non-hierarchical PCI Express topologies such as Mesh and Fat Tree. It supports single-root I/O virtualization which means that I/O can be shared among multiple hosts similar to the way Virtual Machines (VMs) share a piece of hardware on the same host. Express Fabric makes it possible to use more than 3 CPU boards in one configuration.

High Performance for Virtualization Applications

The G25A is a high-performance multicore CPU platform based on Intel’s Xeon D-1500 System-on-a-Chip (SoC). Paired with I/O cards, the G25A can be ideally used for transferring data from and to storage media, the Internet via LTE, wireless, copper or optical Ethernet. Its up to 16 processor cores and built in Intel® VT-d and VT-x support make the board ideally suited for virtualization applications.

The G25A offers high data bandwidth on both the front and the rear I/O interfaces. Two 10 Gigabit Ethernet interfaces are available on RJ45 or M12 connectors at the front, for example.

USB 3.2 Gen 1×1, SATA revision 3.x, PCI Express 3.0 and Gigabit Ethernet interfaces on front and rear complement the I/O possibilities of the board.

Ruggedized Memory and Mass Storage

The memory configuration of the G25A includes a state-of-the-art fast DDR4 DRAM with ECC which is soldered to the board to guarantee optimum shock and vibration resistance. A microSD card device offers space for user applications or as a local boot medium.

System Security and Board Management

For system security, a Trusted Platform Module is assembled on the board. A board management controller provides thermal supervision of the processor and a watchdog for the operating system.

Perfect for Embedded and Harsh Environments

The G25A operates in Windows and Linux environments as well as under real-time operating systems that support Intel’s multi-core architecture.

The G25A comes with a tailored heat sink within 4 HP height. All components are soldered for protection against shock and vibration according to applicable DIN, EN or IEC industry standards. The board is also ready for coating so that it can be used in humid and dusty environments. It is available until 2023.

G229 I/O Extension Board

The G229 offers one M.2 slot, three USB 3.2 Gen 1×1 interfaces, one RS232 interface, one RS422/RS485 interface, one VGA via PCI Express Mini card and up to three flexible slots for two additional RS232 or RS422/RS485 interfaces. It is combined with the G25A to form a space-saving solution with a bigger heat sink.