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The IBR-i7-3517UE COM Express Type 6 module features an Intel Core i7-3517UE dual-core 1.7GHz processor and supports up to 16GB of 1600MHz DDR3 RAM. The module offers low power consumption (TDP 8W) and can operate fanless over an extended operating temperature range of -40°C to 85°C ambient, while the 2.3mm thick PCB is ideal for high vibration environments. Standard features include integrated Gigabit Ethernet controller, up to seven PCI Express X1 lanes, one PCI Express X16, two SATA III (6Gb/s) interfaces, two SATA II (3Gb/s) interfaces, eight USB 2.0 ports, four USB 3.0 ports, LPC bus, SMBus and I2C bus. The module includes three Digital Display Interfaces (DDI) for DisplayPort, HDMI or DVI displays.

Sealevel specializes in COM Express carrier boards built to your specific application requirements. Our extensive library of proven I/O circuits including serial, analog, and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application. COM Express development boards are also available to allow software development to begin immediately while the custom carrier board is designed.

Turn to Sealevel’s custom capabilities for expertise in electrical, mechanical, software, environmental stress screening, project management, and compliance & certification. Call us today to discuss the design capabilities, reliability improvements and design control advantages that a Sealevel COM Express carrier board or system design will bring to your next product.

COM Express Basic with Type 6 connector layout

Includes 1.7GHz (up to 2.8GHz Turbo) Intel Core i7-3517UE dual-core processor

Maximum 16GB DDR3 1600MHz RAM via dual 204-pin SODIMM slots

Integrated Mobile Intel QM77 Express chipset

Variety of I/O interfaces can be included

Extended temperature operation from -40°C to 85°C ambient

Get your COM Express project off to a fast start with the TEVAL2 COM Express carrier board. The TEVAL2 supports Basic and Compact Type 6 COM Express modules. Standard features include six PCI Express X1 slots, one PCI Express X4 slot, one PCI Express (PEG) X16 slot, one Mini PCI Express slot, one Express Card socket, and one SD Card socket. The carrier board includes connectors for digital and analog video, USB, Ethernet, SATA, GPIO/SDIO, serial and audio interfaces. Specific features are COM Express module dependent.

The TEVAL2 carrier board simplifies software development and prototyping while the target application carrier board is designed. Take advantage of Sealevel’s carrier board development services for the fastest time to market. Our extensive library of proven I/O circuits including serial, analog, and digital functionality simplifies the design process, which can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application.

Turn to Sealevel’s custom capabilities for expertise in electrical, mechanical, software, environmental stress screening, project management, compliance & certification. Call us today to discuss the design capabilities, reliability improvements and design control advantages that a Sealevel COM Express carrier board or system design will bring to your next product.

COM Express Type 6 reference carrier board

Supports Basic and Compact Type 6 COM Express modules

Includes various I/O options

Simplifies software development and prototyping

Specific features are COM Express module dependent

The 12009 COM Express Compact Type 6 Evaluation Board enables accelerated development of embedded computing prototypes, dramatically expedites electrical hardware engineering, and reduces costs for new product introductions (NPIs). At 95 millimeters square, the 12009 Compact Evaluation Board is identical in size to a Compact Type 6 COM Express module.

Standard I/O includes Gigabit Ethernet, USB 3.0, USB 2.0, GPIO, RS-232, and Mini DisplayPort. The 12009 evaluation board is designed for the congatec® conga-TC370 COM Express family, with support for 8th generation Intel® Core™ processors, up to 64 GB DDR4 RAM, and TPM 2.0 support.

The complete evaluation kit (Part #12009-001-KT) includes a Type 6 module with Intel Core i3-8145UE CPU and 8 GB DDR4 RAM. Additionally, to improve the development process, the kit includes a 128GB M.2 SATA SSD module (supports Windows® and Linux® operating systems), a desktop power supply, and a wide variety of cables to facilitate connections to serial and Ethernet ports and optional fans. Power button and power-indicating LED also included.

The 12009 COM Express Type 6 Evaluation Board features a wide operating temperature range of 0ºC to 70ºC and is powered via a locking, four-position Molex Micro-Fit connector.

Turn to Sealevel’s custom solutions for expertise in electrical, mechanical, software, environmental stress screening, project management, and compliance & certification. Our extensive library of proven I/O circuits including serial, analog, and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges, and connector types required for your application.

What’s Included

Carrier board, COM module, and plexiglass demonstration enclosure

128GB M.2 SSD Installed

5V Fan with 5 Pin Molex Connector Cable Installed in Enclosure

Molex Connector to 2 DE9 Connectors Cable

(2) 10-Position Connector to RJ45 Cables

Power Button and LED Cable

(2) Pin to 4 Pin Molex Cables, 14.00″ (Item #CA471)

10-Position Connector to Flying Leads, 11.81”

(2) SeaLATCH Panel Mount USB Type A Female to Molex 4 Pin Connectors

Mini DisplayPort Male to HDMI Male Cable, 3′

60W, 21V Power Supply