Archives

March 31, 2025

EmNano-iX701

EmNANO-iX701
Intel® Amston Lake (X7000 Series) Atom® Mini COM Express® Type 10 CPU Module

Features:

• Soldered onboard Intel Amston lake (X7000 Series) SoC Processor
• Soldered on board LPDDR5 SDRAM
• Intel 2.5 Gigabit Ethernet controller
• Single Channel 24-bit LVDS and 1 x DDI port
• Support Intel® Time Coordinated Computing (Intel® TCC)
for Intel®Edge Controls for Industrial

March 31, 2025

COMX-A300

COMX-A300
Intel® Core Ultra /Core Ultra 2 ™ processors (Arrow Lake/Meteor Lake U/H) CPU, COM-HPC Client Size A Module

The main features are

 COM-HPC® Client Size A Module
 Intel® Core™ Ultra Processor (Arrow Lake/Meteor Lake U/H-series)
 Intel Xe LPG graphic up to 128EU, 4 independent 4K display
 Dual-CH DDR5 5600MT/s up to 96GB SODIMM
 Support Max. 4 independent displays
 8.5V~20V Wide Range Voltage Input
 Multiple I/O expansion: 2.5GbE, PCIe Gen5, USB4 & USB3.2 Gen2, SATA3.0

March 31, 2025

conga-TC750

COM Express Type 6 Compact module based on Intel® Core™ Ultra processors (code name “Arrow Lake”)

Cutting edge Intel® Arc™ Graphics with XMX Systolic Arrays and up to 128 EUs
Next level Edge AI performance up to 99 TOPS total
Up to 128 GB RAM with in-band ECC
Intel® performance hybrid architecture with up to 16 cores and 22 threads
PCI Express Gen 4 | USB 4