Archives

July 19, 2023

COMe-cRP6 E2

The new COM–Express® modules, based on 13th Gen Intel® Core™ (former codename Raptor Lake-P) offer a significant performance increase compared to the previous generation and are equipped with up to 14 cores based on Intel® performance hybrid architecture.

The COM-Express® modules provide essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN) and extended temp. range of -40C to +85C (operating).

All features are perfect for applications in demanding areas such as Industrial Automation, Health Care and Automotive.

July 19, 2023

COMe-mRP10 (E2)

The new COM–Express® modules, based on 13th Gen Intel® Core™ (former codename Raptor Lake-P) offer a significant performance increase compared to the previous generation and are equipped with up to 14 cores based on Intel® performance hybrid architecture.

The COM-Express® modules provide essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN) and extended temp. range of -40C to +85C (operating).

All features are perfect for applications in demanding areas such as Industrial Automation, Health Care and Automotive.

July 19, 2023

The new Standard COM-HPC – Delivering future proofed power and connectivity

In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing standard for Modules has been defined by the PICMG: COM-HPC®. This enables more powerful COMs that extend beyond the limits and capabilities of COM Express® (Type 6 and 7) and other COM standards.

While complementary, COM-HPC® is distinct from COM Express®, directly supporting the growing need for more powerful future-proofed compute, scalability, transmission, and network performance.

You will get exclusive insights about:

› COM-HPC® Specification
› Out-Of-Band (OOB) or remote management features
› Our modular approach for a BMC (Board Management Controller) solution
› Positioning of COM Express® and COM-HPC®
› Typical COM-HPC® Use Cases
› Kontron’s COM-HPC® Portfolio and Values Added Services