Archives

October 11, 2023

All Best HPC-CONN Connectors

0.635mm pitch
•400 pin BGA mount
•5 mm or 10 mm stack heights
•LCP Thermoplastic Insulator
•PCB Mount Orientation : Vertical
•Supports up to PCIe®Gen 5 (32.0 GT/s) and 100 Gb Ethernet
•Meets COM-HPC®standard
•Operating temperature: -55°C to 85°C
•Current rating: 2 ampere per pin

October 11, 2023

MSC C6C-RYZ2

The MSC C6C-RYZ2 module is the embedded platform for the AMD RyzenTM Embedded R2000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained real-estate, power and cooling. Customers can choose from a variety of quad and dual-core processors to scale performance and capabilities according to application requirements.

The board provides up to four independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.2/2.0 interfaces complete the compact and power saving module. The MSC C6C-RYZ2 offers hardware based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability. The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 2.0b and DVI as well as up to four USB 3.2 interfaces.

October 11, 2023

SECO SOM-COMe-CT6-EHL

COM Express® 3.1 Type 6 Compact Computer on Module (CoM) with Intel® Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors (Codename: Elkhart Lake).