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The ATX-M-CC462-T6 is a fully featured COM Express Type 6 evaluation carrier board designed for use with the WINSYSTEMS Intel® Tiger Lake UP3 COM Express and other COM Express Type 6 modules. The carrier implements the full capabilities of the Type 6 connectors extant on the WINSYSTEMS COMeT6-1100 COM Module and is compliant with PICMG® COM.0 Rev 3.0 Specifications.

The ATX-M-CC462-T6 is a standard, MicroATX form factor COM Express Type 6 carrier board that is compatible with the WINSYSTEMS COMeT6-1100 COM Express Type 6 Intel Tiger Lake UP3 design or other compliant COM Express Type 6 boards.

Industrial Evaluation Carrier Design:
• Micro-ATX form factor: 9.6 x 9.6 inches (244 x 244mm)
• Made in the USA
• -40ºC to +85ºC with supporting cooling options
• ATX Mode: Standard ATX Power input
• AT Mode: 12VDC +/- 5%
• Supports all interfaces on the WINSYSTEMS COMeT6 Modules

Graphics:
• Support for Dual Channel LVDS and eDP, including backlight

Connectivity and I/O:
• 4 x USB 3.2 Gen1 (2x Front Panel Type A, 2x Header)
• 4 x USB 2.0 (2x Front Panel, 2x Header)
• 2 x RS 232 2pin (Tx/Rx) from COMe Module
• 2 x RS232/422/485 Multiprotocol Legacy mode

Storage/SATA Channels:
• 4x SATA Type III (6Gb/s) channels

Expansion and Configuration Options:
• 3x Mini-PCI Express (1x with mSATA support)
• M.2 M-key 2280 with support for PCIe x4 NVMe

Software:
• Windows 10 and 11
• Linux

The GX1 offers a cost-effective PCIe Gen 3 switching solution via the CompactPCI Serial backplane. It comes with Express Switch or Express Fabric functionality. Some typical industrial applications include multi-CPU high speed video and image processing, supercomputing and virtualization. The GX1’s final configuration depends on the end application. It is only available within a project context and cannot be ordered as a single standard product.

High-Speed Connection

The GX1 enables high speed serial point-to-point communication between the CPUs and between the CPUs and end point modules. Configurable data transfer rates can reach up to 985 MB/s per PCIe lane.

Flexible Configuration of Multi-Processor Systems

The switch allows connection of multiple endpoints and multiple CPUs. This way, it is possible to build powerful and cost-effective multi-processor systems. The switch ports can be configured flexibly using an application running on the root complex CPU. This way, the switch can be adapted to different backplane designs. No programming is required to set up the ports. Setup and diagnostics tools are available from the chip manufacturer.

Express Switch Functionality

The GX1 supports both multi-root and multi-host configuration. For multi-root configuration, the GX1 can be partitioned into four fixed virtual bridges supporting up to four root complexes. Each root complex is allowed to enumerate its own endpoints. Non-transparent bridging is not required in this case. For multi-host configuration, the primary host CPU is acting as a root complex enumerating all the endpoints and up to two additional secondary host CPUs connected over two non-transparent bridges. In this configuration, all host CPUs are able to communicate with all endpoints. Using the non-transparent bridging the primary CPU is able to share control, status and interrupt information with the secondary hosts. This allows more efficient load sharing in data intensive computing applications.

Express Fabric Functionality

GX1 can also be equipped with an Express Fabric chip which is especially suitable for complex non-hierarchical PCI Express topologies such as Mesh and Fat Tree. It supports single-root I/O virtualization which means that I/O can be shared among multiple hosts similar to the way Virtual Machines (VMs) share a piece of hardware on the same host. Express Fabric makes it possible to use more than 3 CPU boards in one configuration.

Advantech COM-HPC® Server Size D Module
Intel® Xeon® D-2700 processors
Up to 20 Cores, 30MB LLC Cache, 118W TDP
Quad channel DDR4-3200 RDIMM/LRDIMM up to 512GB (Both ECC & Non-ECC)
32 x PCIe Gen 4, 17 x PCIe Gen 3, 4 x 25GBASE-KR, IPMB
Supports iManager, Embedded Software APIs, and WISE-DeviceOn