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CM22301 uses Intel® sixth-generation Skylake platform and Core M low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.1GHz and the display output resolution can be up to 4K. CM22301 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. CM22301 supports up to 16GB dual-channel low-voltage DDR3L memory populated onboard, and up to 64GB on-board solid state disk silicon, as benefit the development of ruggedized products for harsh environment applications.
As defined by VITA 59 specification, CM22301 provides up to 6 PCIe lanes, enabling flexible functionality expansions, such as NICs, DAQs, video capture and so on. Meanwhile, CM22301 also provides up to date computer interfaces like GbE, SATA3, USB3.0/2.0, HD Audio, etc. CM22301 uses the same 220pin board-to-board connector and Type10 pin out definition as COM Express.
CM22301 integrates Intel® HD Graphics 515 and GT2 series graphics display core with 24 EU. And the display memory can reach up to 1.7GB shared with system memory, and the maximum dynamic frequency of the GPU can be up to 1GHz. Its display interface supports eDP/DP/HDMI/DVI and the output resolution is up to 4K. The integrated GPU also supports DirectX 12, OpenGL 4.4 and OpenCL 2.1. Besides, a wide range of media processing capabilities are implemented by hardware acceleration, including both Encode and Decode of AVC/VC1/MPEG2/H.264/H.265/VP8/JPEG.
CM22301 fully complies with VITA 59 standard, as defines extra considerations to improve the cooling efficiency by using the entire PCB. In addition, CM22301 provides an effective guarantee for the anti-shock and anti-vibration design of various equipment and devices used in harsh environments.
Target applications:
Hand-held and portable devices, Wireless data transmission, Vehicle-mounted and onboard navigation devices, Video monitoring equipment

PICMG 1.3 SBC support 4th generation Intel® Core™ i7 / i5 / i3

ntel® Q87 Express, DDR3/DDR3L up to 16GB, Onboard display port , VGA & DVI & LVDS,

2 x Giga LAN, 4 x USB 2.0, 6 x USB 3.0, 6 x COM, HD Audio, 4 x SATAIIl with RAID, IrDA,

SMBUS,GPIO, 1 x Mini-PCIe .

The SV2-MOVIE is a peripheral slot board for PICMG® CompactPCI® Serial systems and acts as carrier for an MXM 3.0/3.1 graphics module. The SV2-MOVIE is provided with four DisplayPort front panel connectors and can accommodate either a type A (82x70mm2) or type B MXM graphics module (82x105mm2).
MXM (Mobile PCI Express Module) is an interconnect standard for GPUs created by MXM-SIG. MXM cards are mostly equipped with an AMD or Nvidia GPU core. With respect to a reasonable thermal management, a low power GPU is recommended for industrial applications together with the SV2-MOVIE.

For best performance, the SV2-MOVIE should be operated in a CompactPCI® Serial fat pipe slot, which provides a PCI Express® x8 host interface. The SV2-MOVIE is equipped with a PCIe Gen3 redriver for optimum signal integrity.
For use with suitable MXM graphics modules, low profile passive heat spreaders are available, for either 4HP or 8HP front panel width. In addition, the CompactPCI® Serial rack must provide suitable forced airflow (e.g. by fans).