Archives

Material: ABS

Finish: Chrome Plated

– AMD Embedded Ryzen 7nm SoC – V2000 APU
– COM Express® R3.0 Compact Module Type 6 Pinout
– Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC)
– High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0
– Four Display (DP++, HDMI, VGA, LVDS)
– Supports iManager, Embedded Software APIs and WISE-DeviceOn

COM-HPC carrier board designs

Good preparation is half the battle

COM-HPC is the upcoming new standard for modular high-end edge servers. It provides significantly faster and almost twice as many interfaces as COM Express. As a result, carrier board design requirements are increasing exponentially. How can developers prepare for the new challenges?