Archives

Computer-On-Modules (COMs) are successfully introduced in the industry and play an important role in many embedded applications. Ever increasing CPU performances and IO bandwidths now reach new levels that make them interesting for emerging technologies like Internet of Things (IoT), artificial intelligence (AI) or 5G networks. Such applications call for new Computer-On-Module solutions that can deliver the desired performance footprints for the next decade. PICMG picked up the challenge and developed a new industry standard for high performance computing modules. With the COM-HPC specification, application designers now can implement innovative solutions for emerging markets.

This white paper introduces you to the standard and its groundbreaking new capabilities. It looks at key applications and analyzes how they can benefit from the performance potential, bandwidth and connectivity, COM-HPC offers. In addition, it sheds some light on developing resources, first product solutions and support from the ecosystem.

– Evaluation Carrier Board for COM-HPC Client Type Modules
– Compliant with the upcoming COM-HPC Spec
– Routing of the entire signals provided by COM-HPC specification to standard interface connectors

The embedded computing industry is about to launch COM-HPC as the next-generation standard for modular system designs. Since COM-HPC is complex and sometimes misunderstood, there is a need for clear information. It is important to know what benefits the COM-HPC client modules offer and how they differ from COM Express. COM-HPC therefore addresses two separate target groups, each with different needs. So what potential do the two new sub-specifications have and how do they differ?