Archives

May 6, 2021

3U CompactPCI Serial 5-slot SSR w/ RTM no Ethernet 1CPCIS-305-R010

3U CompactPCI Serial Backplane with 5 CPCI-S.0 slots, system slot right, with rear IO: 1x CPCI-S.0 CPU slot, 4x CPCI-S.0 peripheral slots, with connectors for RTMs (RearTransition Modules) in slots 2 to 5, system slot (Slot 5) has one connector for RTM -> 5RJ6 – no Ethernet on the backplane

Product Features
-CompactPCI Serial (PICMG CPCI-S.0) compliant backplane
– High-speed connectors supporting data transfer rates up to 12 Gbps in all 5 slots
– Single star topology for serial interfaces such as PCI Express, SATA, USB2 and USB3 are provided by the CPCI-S.0 system slot
– Europacard form factor in 3U height
– No Ethernet on backplane
– Designed to support Rear Transition Modules
– With RTM connectors

April 29, 2021

Computer-on-module for high performance computing

Taking standardized COMs to the next level

The long-established COM Express® standard for Computer-on-Modules (COM) has recently been joined by COM-HPC®, a new High Performance Computing standard from the PCI Industrial Computer Manufacturers Group (PICMG®). What is the motivation behind this new standard and what does it mean for the widely adopted COM Express®?

Download white paper

April 23, 2021

Trenz Electronic TE0830

The Trenz Electronic TE0830 is a COM-HPC compatible Zynq UltraScale+ module (12 x 12 cm). COM-HPC is the new PICMG-standard (https://www.picmg.org/openstandards/com-hpc/).

The TE0830 features high memory connectivity (PS up to 8 GByte and PL DDR up to 16 GByte) as well as fast Gigabit transceivers (up to 32.75 Gb/s) allowing PCIe Gen4 to be implemented as root complex or endpoint. Storage memory can be expanded as desired (SATA or M.2 PCIe storage card on carrier). In addition to these interfaces, USB, Gigabit Ethernet and several other common interfaces are available. The JTAG connection for programming the ZynqMP can be done via GPIO pins or conveniently via Ethernet (with current firmware), so that the use in the server area is also possible.

TE0830 is currently under development, but an initial prototype has been fielded and functionality is currently being verified on the TEBT0830 test carrier. Expected release in Q3/Q4 2021 (with reservations).

The prototype configuration of TE0830 will be available for approximately 6.000,- Euros, but there are still many configuration options available that you can customize to meet your specific needs.

More information will be posted to our Wiki COM-HPC SoM documentation https://wiki.trenz-electronic.de/display/PD/COM-HPC+SoM+Documentation over time.

Development Support
Latest documentation, design support files and reference designs with source files are available for download free of charge.