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Samtec offers a high-density interconnect system that meets the COM-HPC® standard for high-performance Computer-On-Modules. COM-HPC® meets the growing demands for embedded systems to provide ultra-high speed performance and extended connectivity with limitless scalability.

Key Features:
– High-performance, flexible open-pin-field array
– High-speed PCIe® 6.0 and 100 Gb Ethernet capable
– 400 pin BGA mount
– 4 rows x 100 columns
– 2.2 / 2.4 / 2.2 mm row pitch
– 0.635 mm pitch
– 5 mm or 10 mm stack heights
– Dimensions: 68.62 mm x 9 mm x stack height
– Up to 360 W at 11.4 – 12.6 Volts

– COM-HPC® Client type, size A
– 11th Gen Intel® Core™ Processor, up to 4 cores/28W TDP (Tiger Lake-UP3)
– Up to 64GB Dual-channel DDR4 Non-ECC 3200 MT/s on two SO-DIMM sockets, support In-Band ECC for industrial SKUs
– 1x PCIe Gen 4 x4, 2x PCIe Gen 3 x1, 1x PCIe Gen 3 x2, 1x PCIe Gen 3 x4
– Up to 10 PCIe Gen 3 lanes (x16/ x8/ x4/ x2/ x1) from PCH
– 1x 1GbE Base-T, 1x 2.5GbE Base-T with vPro
– Optional 4x USB 3.2 Gen 2
– Support multimedia interface:
3x DDI (HDMI/DP), 1x eDP/MIPI-DSI for display
2x Soundwire, 1x I²S for audio
1x MIPI-CSI for camera
– Extended operating temperature: -40 ~ 85 °C (by CPU SKUs)
– Sample available in 2021 Q3 August [Preliminary]

ADLINK nanoX-EL Key Features:
• In-Band ECC error correction LPDDR4
• 2.5GbE Ethernet, with optional TSN
• PCIe Gen3 lanes, USB 3.2 10Gbps
• 3x 4K display
• Real Time I/O (GPIO, UART, I2C)
ADLINK nanoX-EL supports 6th generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. nanoX-EL modules support In-Band ECC dual channel DDR4 memory up to 16GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.