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ADLINK Express-VR7 Key Features:
• AMD Ryzen™ Embedded V3000 Processor
• 8 Cores at 15W/45W — Best Performance per Watt in its class
• COM Express Rev. 3.1
• Up to 64GB DDR5 SO-DIMM at 4800 MT/s, ECC
• 14x PCIe Gen4 lanes
• 2x 10G Ethernet, 1x 2.5G Ethernet
• Extreme rugged operating temperature: -40°C to 85°C (optional)

ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
The module provides dual-channel DDR5 memory at 4800 MT/s with ECC and includes 2x 10G Ethernet plus 1x 2.5GB Ethernet ideal for your various next-gen networking applications at the edge.

3U CompactPCI® Serial Intel® 11th Gen. Processor Blade

Intel® 11th Gen. XEON/Core processor with RM590E PCH
Up to 64GB DDR4 by two channels, with ECC or Non-ECC options
Up to 3 10Gbps USB Type-C, 2 in 3 DisplayPort Alternate Mode enabled, and 2 2.5Gbps RJ45 Ethernet ports on front panel
Up to 2 M.2 sockets for SATA 3.0 SSD module on MIC-330V2 with Mezzanine-1 card
Reserved 1 M.2 sockets for SATA 3.0 SSD module, Fe-RAM function, and super cap. on MIC-330V2 with Mezzanine-2 card
Designed to meet EN50121-4, EN50121-3-2 and EN50155
PICMG CompactPCI Serial(CPCI-S.0 R2.0) compliant

3U CPCI-Serial AI Inference Board Based on NVIDIA® Jetson AGX Orin™

3U CPCI-S Computing card for Edge AI
Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS
Supports GbE, 2 x USB 3.2 Gen 2 (10 Gbit/s), 1 x HDMI on 4HP
Supports 1 x DB9, 1 x micro USB on 8HP I/O-1
Supports 4 x GMSL2.0, 1 x micro USB on 8HP I/O-2
On-board PCIe 3.0 x4 M.2 M key storage
Rich I/O resources (PCIe3.0 x8, GbE and 10GbE) connected to a backplane