Archives

March 7, 2014

OT905-B

DFI’s new COM Express® Compact module, the OT905-B series, is one of the few in the industry that is powered by the dual-core AMD Embedded G-series APUs. It is the perfect solution for applications that require low power and significant graphics performance in a small form factor module.

The graphics-rich modules come available in 2 models. The OT905-BT56N uses the AMD® T56N APU while OT905-BT40N uses the T40N APU with power consumption of 18W TDP and 9W TDP respectively. The dual-core G-series processors offer high performance at low power consumption and supports up to 8GB DDR3 system memory. In addition, the AMD Turbo Core 2.0 technology provides additional boost capability without the need for additional power draw.

Integrated with the Radeon discrete-level GPU in the processor, the modules offer advanced 3D graphics, DirectX 11 which supports stunning 3D visual effects and dynamic interactivity, OpenGL 3.2, OpenCL 1.1, and dual display via the VGA and 24-bit dual channel LVDS interfaces. All these contribute to delivering excellent graphics capability.

The low power module design which is compliant to COM Express® R2.0 Type 2, take full advantage of the AMD® A55E Controller Hub which is packed with high performance I/O capabilities through 8 USB 2.0, 6 PCIe x1, 4 PCI, 1 IDE, 8-bit DIO, LPC and SMBus.

With advanced performance in both computing and graphics performance, these modules are ideal for applications such as industrial controls to create more power-efficient factory equipment, medical appliance such as bedside terminals, POS, and the transportation market such as traffic control devices.

March 7, 2014

CR900-B

The COM Express Basic form factor module, CR900-B Type 2, offers the 3rd generation Intel® CoreTM processors.

The module supports the quad-core Intel® CoreTM i7-3610QE and the dual-core Intel® CoreTM i5-3610ME processors. These processors offer higher performance at lower power consumption than the 2nd generation Intel® CoreTM processors which are also supported on these module boards.

The low power module takes full advantage of the mobile Intel® QM77 Express chipset which is packed with high performance I/O capabilities to provide increased mobile computing and graphics performance.

Targeted at multimedia and medical applications, the module supports VGA and LVDS interfaces for dual independent display with resolution up to 1920×1200 @ 60Hz.

CR900-B supports 2 DDR3/DDR3L SODIMM up to 16GB, 1 PCIe x16, 5 PCIe x1, 4 PCI, 1 LPC, 1 IDE, 1 VGA, 1 LVDS, 8 USB 2.0, 4 SATA: 2 SATA 3.0, 2 SATA 2.0, 4-bit input and 4-bit output GPIO and 1 Gigabit LAN interface.

The mobile embedded module boards are ideal for applications requiring a stable revision-controlled platform, such as gaming, medical equipment, and KIOSK embedded applications.

March 7, 2014

CP908-B

Intel® HM55
Intel® Core i7/i5/i3
Intel® Celeron®
1 DDR3 SODIMM up to 4GB
4 PCIe x1, 4 PCI, 1 LPC, 1 SMbus, 1 IDE, 1 VGA, 1 LVDS, Multiplex digital display with PCIe x16(SDVO/HDMI/Display Port)
8 USB
4 SATA 2.0
8-bit DIO
1 Gigabit LAN interface