Archives

January 22, 2015

ept hm 2.0 hard metric connectors

The hardmetric connector system ept-hm 2.0 was developed according to the international standard IEC 61076-4-101. Thus the user can rely on a worldwide standard for the connection of PCBs using connectors with a large number of contacts with 2.00mm grid. Only one example for the use of hardmetric connectors are applications for CompactPCI.

September 2, 2014

TP D2x/msd

TP D2x/msd is a PC-compatible low power, high functionality, 3U CompactPCI® board supporting the Intel Atom processor E3800 product family with 4 Gbytes of DDR3L ECC DRAM. This board can support a PMC/XMC site and features a variety of interfaces including user Flash memory, six SATA, up to four Gigabit Ethernet, two serial, four USB, a CANbus and an HD stereo audio interfaces. A Fast Boot software package is also supported. The TP D2x/msd is a commercial board suitable for a range of environments (air-cooled or fanless) within industrial control, transportation, security, telemetry, scientific and medical applications. Options to operate in temperatures ranging from -40°C to +85°C are available. Ruggedized conduction-cooled versions are supported.

August 26, 2014

TP CR1/XMC

TP CR1/XMC 3U XMC carrier board provides a flexible solution for designers wishing to add XMC I/O functionality to a CompactPCI 32-bit 33/66MHz system. The carrier accommodates one single width XMC module conforming to the IEEE 1386 Common Mezzanine Card standard, with front panel I/O and 64-bit rear I/O. XMC modules supporting up to x4 PCI Express® interfaces can be used. A wide range of commercial and proprietary designed XMC modules can be supported such as SAS, LAN, WAN, Graphics and Communications Controllers. The XMC site provides XMC rear I/O via the PMC Pn4 connector, where the rear I/O signals are routed to the CompactPCI J2 connector. There is an optional rear panel I/O Transition Module. Options to operate in temperatures ranging from -40°C to +85°C are available. This board is rear I/O plug compatible with the ruggedized conduction-cooled version