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The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel® Atom™ E3900 processor. This low power industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board containing user specific I/O requirements.

COM Express modules allow users to retain the same carrier board design across scalable CPU series and over multiple generations of COM Express modules, providing a long project lifetime. Updating a COM Express module to improve performance or replace an end-of-life processor drastically improves your time to market when revising existing projects. Users can choose the default BIOS settings and layout or request a custom-branded configurable BIOS to support specific project requirements.

The COMeT10-3900 supports Linux, Windows® 10, and other x86-compatible real-time operating systems. Drivers are available from the WINSYSTEMS website.

PERFORMANCE FOR INDUSTRIAL IOT
• Intel Atom E3900 Processor, formally Apollo Lake-I
• Up to 8GB LPDDR4 2400 MT/s System Memory
• Intel Low Power Gen9 Graphics Engine
• Full-HD and 3D Graphics acceleration

SECURITY
• On-board Discrete TPM 2.0 Hardware Security

RUGGED DESIGN
• -40°C to +85°C Operating Temperature Range
• COM Express Type 10 Mini, Small Form Factor
• Wide Range Power Input (4.75V – 20V DC)

EXPANSION
• 4x PCIe lanes configurable as 4×1 (Default), 2×1 + 1×2, or 1×4
• 2x USB 3.1 Gen 1, 6x USB 2.0
• 1x i210 1Gb/s Ethernet RGMII with IEEE 1588 support
• HD Audio
• 2x SATA III (6 Gb/s)
• 2x UART
• 4x GPI, 4x GPO (SDIO option for MicroSD socket)

STORAGE
• On-board eMMC 5.x (8GB to 128GB)

DISPLAY
• 1x Dual Mode Display (DisplayPort, HDMI, DVI)
• 1x eDP (optional single channel LVDS)

SOFTWARE SUPPORT
• Custom configurable UEFI-based AMI BIOS
• System Management Libraries and Tools
• EAPI v1.1 support for System Info, WDT, I2C, Brightness, GPIO, and User Storage Area

• 6th Generation Intel Atom® x6000 series (“Elkhart Lake“)
• Dual/Quad core computing power with up to 2.9 GHz
• Up to 16 GB LPDDR4/4x soldered with inband ECC (option)
• 1x Gbit Ethernet
• 2x USB 3.1 (Gen2) and 8x USB 2.0
• Up to 4 PCIe lanes (Gen3)
• Dual Display support with DP (4K) and eDP (4K) or LVDS (Single Channel)
• Up to 256 GB eMMC Flash, soldered
• Extended temperature support from -40°C to +85°C

The COM Express® Mini Module TQMxE40M is available with Intel® Atom™, Pentium® and Celeron® processors of the 6th generation (10 nm process technology) and impresses with increased CPU computing power, fast LPDDR4/4x memory up to 16 GByte, Inband ECC and significantly improved performance values in the area of graphics and image processing. Combined with the compact COM Express Mini design (84 mm x 55 mm) and the low power dissipation (4.5 – 12 Watt TDP), the module opens up new possibilities in industrial automation, measurement technology, aviation, medical technology and many other fields of application, especially in the extended temperature range from -40°C to +85°C. Two USB 3.1 Gen 2 ports (2x 10 Gbit/s) as well as four PCIe Gen 3 lanes (8 GT/s), offer a high bandwidth for extensions and additional functions on the carrier board.
Equipped with the latest Intel graphics processor, 4K screen resolution, impressive 3D video processing as well as significantly increased video encoding/decoding performance are provided. Virtualization and new functions such as Time Coordinated Computing offer the best conditions for real-time applications and time-synchronous IOT solutions. The optionally available eMMC flash memory (up to 256 GByte) and assembly options for either embedded DisplayPort (eDP) or LVDS offer great flexibility. The integrated board controller supports thermal management, a multi-stage watchdog, “Green ECO-Off” for minimum standby consumption and offers customer-specific configuration options (flexiCFG) for a high degree of flexibility. Combined with the optional paint finish and optimized cooling solutions, the TQMxE40M is also perfectly suited for rugged applications.

The MSC C10M-AL module is based on Intel’s multi-core system-on-chip (SOC) Atom generation (codenamed “Apollo Lake”). It integrates next generation Intel processor core, graphics, memory, and I/O interfaces into one solution. Manufactured in 14nm processor technology this multi-core Atom processor provides outstanding computing and graphics power and is more power efficient compared to its predecessors. The MSC C10M-AL brings dual independent display support, DirectX 12, fast DDR3L memory, two USB 3.0 and 6 USB 2.0 on a compact, power saving and cost-efficient COM Express Mini module. Different SOCs with dual- and quad-core processors are supported. Besides an extensive set of interfaces and features, the MSC C10M-AL optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). Type 10 pin-out supports digital display interfaces like DisplayPort, HDMI and DVI. The rugged design with soldered memory, optional ECC support and extended temperature range combined with a long-term availability commitment make it perfectly suited for modern IoT solutions.

Intel Atom X7-E3950 quad-core 1.6/2.0GHz, 12W
Intel Atom X5-E3940 quad-core 1.6/1.8GHz, 9.5W
Intel Atom X5-E3930 dual-core 1.3/1.8GHz, 6.5W
Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W
Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W
Integrated Intel Gen. 9 HD graphics
Up to 8GB DDR3L SDRAM (ECC option)
Two SATA 6Gb/s mass storage interfaces
eMMC option
DisplayPort/HDMI/DVI interface
LVDS/Embedded DisplayPort interface
Two independent displays supported
DirectX 12, OpenGL 4.3, OpenCL 2.0
Two USB 3.0/2.0 and six USB 2.0 interfaces
Two high-speed UARTs
Up to four PCI Express™ x1 lanes
UEFI Firmware
Trusted Platform Module (option)
Extended temperature variants