Archives

July 19, 2023

COMe-mRP10 (E2)

The new COM–Express® modules, based on 13th Gen Intel® Core™ (former codename Raptor Lake-P) offer a significant performance increase compared to the previous generation and are equipped with up to 14 cores based on Intel® performance hybrid architecture.

The COM-Express® modules provide essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN) and extended temp. range of -40C to +85C (operating).

All features are perfect for applications in demanding areas such as Industrial Automation, Health Care and Automotive.

July 19, 2023

COMe-mRP10 (E2)

The new COM–Express® modules, based on 13th Gen Intel® Core™ (former codename Raptor Lake-P) offer a significant performance increase compared to the previous generation and are equipped with up to 14 cores based on Intel® performance hybrid architecture.

The COM-Express® modules provide essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN) and extended temp. range of -40C to +85C (operating).

All features are perfect for applications in demanding areas such as Industrial Automation, Health Care and Automotive.

October 25, 2022

COM Express Type 10 Mini Module

The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel® Atom™ E3900 processor. This low power industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board containing user specific I/O requirements.

COM Express modules allow users to retain the same carrier board design across scalable CPU series and over multiple generations of COM Express modules, providing a long project lifetime. Updating a COM Express module to improve performance or replace an end-of-life processor drastically improves your time to market when revising existing projects. Users can choose the default BIOS settings and layout or request a custom-branded configurable BIOS to support specific project requirements.

The COMeT10-3900 supports Linux, Windows® 10, and other x86-compatible real-time operating systems. Drivers are available from the WINSYSTEMS website.

PERFORMANCE FOR INDUSTRIAL IOT
• Intel Atom E3900 Processor, formally Apollo Lake-I
• Up to 8GB LPDDR4 2400 MT/s System Memory
• Intel Low Power Gen9 Graphics Engine
• Full-HD and 3D Graphics acceleration

SECURITY
• On-board Discrete TPM 2.0 Hardware Security

RUGGED DESIGN
• -40°C to +85°C Operating Temperature Range
• COM Express Type 10 Mini, Small Form Factor
• Wide Range Power Input (4.75V – 20V DC)

EXPANSION
• 4x PCIe lanes configurable as 4×1 (Default), 2×1 + 1×2, or 1×4
• 2x USB 3.1 Gen 1, 6x USB 2.0
• 1x i210 1Gb/s Ethernet RGMII with IEEE 1588 support
• HD Audio
• 2x SATA III (6 Gb/s)
• 2x UART
• 4x GPI, 4x GPO (SDIO option for MicroSD socket)

STORAGE
• On-board eMMC 5.x (8GB to 128GB)

DISPLAY
• 1x Dual Mode Display (DisplayPort, HDMI, DVI)
• 1x eDP (optional single channel LVDS)

SOFTWARE SUPPORT
• Custom configurable UEFI-based AMI BIOS
• System Management Libraries and Tools
• EAPI v1.1 support for System Info, WDT, I2C, Brightness, GPIO, and User Storage Area