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DFI launches a new COM Express® Basic form factor module – CM901-B Type 6, powered by the AMD Embedded R-Series APUs. The board supports Quad-core AMD R-464L/R-460H and Dual-core AMD R272F APUs with multiple GPU configurations. These processors enable an exceptional visual experience across applications with efficient hardware video decode, along with GPU assisted video encoding enabling fast video conversion.
This graphics-rich module features 2 DDR3 1066/1333/1600MHz SODIMM that supports up to 8GB system memory, 1 Gigabit LAN controller, 4 USB 3.0 to process more data load, 4 USB 2.0, 4 SATA 3.0 with speed up to 6Gb/s for applications that need fast storage speed, 1 PCIe x16, 7 PCIe x1, 8-bit DIO for device controls, 1 LPC for legacy I/O devices, and an optional SSD storage device.
With excellent performance in computing and graphics, this embedded module is ideal for applications requiring a stable revision-controlled platform, such as video surveillance, medical imaging, and security imaging embedded applications.

DFI’s new Type 2 COM Express® Compact module, the CD905-B series offer the next generation Intel® Atom processors. These low power module boards pair an Intel® NM10 Express chipset with a range of Intel® Atom processors, from the power efficient Intel® Atom N2600 processor to the enhanced Intel® Atom D2700 processor.

The CD905-B series feature 1 DDR3 800/1066MHz SODIMM that supports up to 2GB system memory, 1 Gigabit LAN controller, 2 Serial ATA 2.0 ports with speed up to 3Gb/s, 8 USB 2.0 ports, 4 PCIe x1 interfaces, 4 PCI interfaces, 8-bit DIO, and a High Definition audio interface.

In addition, this new platform series includes Intel® Hyper-Threading Technology that delivers thread-level parallelism and provides a significant increase in performance for multithreaded applications.

ADLINK’s COM Express computer-on-module (COM) offerings include the cExpress-BT2, cExpress-BT, and nanoX-BT – PICMG COM.0 Rev.2.1 Type 2, Type 6 and Type 10 form factors, respectively – with I/O features typical of x86 architecture: up to 3 PCIe, 2 SATA, and 8 USB ports are provided for scalability in application system layouts. To ensure reliability and stability, all of the modules are verified with international standards for shock and vibration and have an extreme rugged operating temperature range of -40°C to +85°C.