Archives

Key Features:
– PICMG COM.0 R3.0 Type 6 module with Hexacore Intel® Core 8000 series and Xeon E-2000 series processors
– Up to 48GB Dual Channel DDR4 at 2133/2400MHz
– Three DDI channels, one LVDS (or 4 lanes eDP), supports up to 3 independent displays
– One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel® Optane™ Memory Technology support)
– GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions

COM Express Type 6 Basic module based on 8th Generation Intel® Core™ processor family

– 8th Generation Intel® Core™ processor with up to 6 Cores
– Intel® Xeon® processors for data center applications
– Support for USB 3.1 Gen2 with 10Gb/s
– Intel® Optane™ memory support
– ECC memory support
– Up to 32 GByte dual channel DDR4 memory

COM Express® Type 6 module based on AMD Ryzen Embedded V1000 Series SOC

– AMD’s Next Gen V1000 processor Series
– “Zen” core architecture with up to 4 cores
– Improved graphic performance with “Vega” GPU
– Up to 32GByte dual channel DDR4 3200MT/s memory
– TDP scalable down to 12W
– up to 4 x 4K DP / eDP