Archives

July 12, 2018

cExpress-AL: COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly codename: Apollo Lake)

Key Features
– Intel Atom® E3900 series, Pentium® and Celeron® SoC (VT-x/VT-d support)
– Up to 8GB Dual Channel non-ECC DDR3L at 1867/1600MHz
– Newest Intel® Gen9 Low Power graphics, Up to 4k resolution and H.265 codec
– Two DDI channels, one LVDS (VGA/eDP by build option), supports up to 3 independent displays
– Up to five PCIe x1 Gen2 (configurable to x2, x4), eMMC 5.0 (build option)
– Two SATA 6 Gb/s, three USB 3.0/2.0 and five USB 2.0, GbE (IEEE 1588)
– Extreme Rugged operating temperature: -40°C to +85°C (build option for selected SKUs)

July 12, 2018

cExpress-SL: COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)

Key Features
– 6th Generation Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (codename: Skylake)
– Up to 32GB non-ECC Dual channel DDR4 at 2133/1867 MHz
– Two DDI channels, one LVDS (or 4 lanes eDP), support up to 3 independent displays
– Up to 6 PCIe x1 (by build option, up to Gen3 dependent on SKU)
– GbE, up to 3x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions
– Extreme Rugged operating temperature: -40°C to +85°C (build option)
– cTDP support on specific skus

July 12, 2018

cExpress-KL: COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)

Key Features
– 7th Generation Intel® Core™ and Celeron® Processors
– Up to 32GB Dual Channel DDR4 at 1867/2133MHz
– Supports up to 3 independent displays in combinations of DDI, LVDS, VGA, eDP
– GbE, up to 6 PCIe x1 (build option)
– Three SATA 6 Gb/s, four USB 3.0 and four USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions
– Extreme Rugged operating temperature: -40°C to +85°C (build option)