Archives

Key Features
– Intel Atom® E3900 Series, Pentium® and Celeron® SoC
– Up to 8GB Dual Channel soldered non-ECC DDR3L at 1867/1600MHz
– Newest Intel® Gen9 Low Power graphics, Up to 4k resolution and H.265 codec
– Four PCIe x1 Gen2 (configurable to x2, x4), GbE
– Two SATA 6 Gb/s, two USB 3.0 and six USB 2.0, eMMC 5.0 (build option)
– Supports Smart Embedded Management Agent (SEMA®) functions
– Extreme Rugged operating temperature: -40°C to +85°C (build option for selected SKUs)

Key Features
– 5th Gen Intel Core and Xeon Processors (formly codename: Broadwell)
– Up to 32GB dual channel DDR3L at 1600 MHz
– 3x DDI channels, one LVDS and VGA, support up to 3 independent displays
– Seven PCIe x1 and one PCIe x16
– GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions
– Extreme Rugged operating temperature:-40°C to +85°C (build option)

Key Features
– 7th Gen Intel® Core™ 7000 series and Intel® Xeon® Processors
– Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz supports both ECC and non-ECC memory)
– 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays
– 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)
– GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions
– Extreme Rugged operating temperature: -40°C to +85°C (build option for 25W TDP SKUs)