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The CPU-162-22 is a rugged COM Express module designed to deliver intense computation while meeting the requirements for industrial and rugged fanless applications.
Compliant with PICMG COM Express R2.1, Type 6, the CPU-162-22 is a 95x125mm (Basic) form factor module based on the 6th Generation Intel Core processor family (i7, i5, i3 and Celeron), up to four cores and up to 32GB SO-DIMM RAM.
Other features include high speed interfaces: one Gbit Ethernet, four SATA 3.0 with RAID support, four USB 3.0 and eight USB 2.0, eight and sixteen PCIe Gen 3 lanes, and three independent video ports (LVDS, VGA and DDI supporting up to 4096×2304@60Hz).
The CPU-162-22 is a solid building block for projects where reliability in harsh conditions is mandatory, and long term availability is a must, thanks to an operating temperature of -40 to +85°C, support for RAID 0/1/5/10, optional conformal coating and long term support/lifecycle programs.
Supported operating systems include Windows 10 IoT Enterprise and Linux; moreover, the CPU-162-22 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/ OSGi middleware for IoT gateways.
Distributed and supported by Eurotech, ESF adds advanced security, diagnostics, provisioning, remote access and full integration with Everyware Cloud (EC), Eurotech IoT integration platform (separately available).
Professional Services are available for the CPU-162-22, starting from BIOS personalization and including carrier board design, system development and production. Deep module customization, such as feature changes are also available.

FEATURES:
Powerful – Comes with 6th Gen Intel Core CPUs

Small – Complies with PICMG COM Express R2.1, with a 95×125 (Basic) form factor and a Type 6 pinout

Rich – Includes the QM170 chipset, delivering multiple interfaces, including three independent video ports, 16+8 PCIe lanes, four SATA interfaces with RAID and much more

Rugged – Supports wide operating temperature (-40 to +85°C) and conformal coating options

Low Power – Enables fanless designs with DDR4 and a CPU TDP of only 25W

IoT Native – Provides native support for IoT, including IoT middleware and access to Eurotech’s IoT Integration Platform

The CPU-162-23 brings the computational performance and RAM capacity of a server to the field. It supports extended temperature range (-40 to +85°C) and ECC memory to operate reliably in industrial and rugged applications.

The CPU-162-23 can be configured with any member of the Xeon/Pentium D-1500 family, ranging from 4 to 16 cores and is available with up to four SO-DIMM sockets for a total of 64GB DDR4 with or without ECC.

The CPU-162-23 is a headless module with a Basic form factor (125x95mm) that is fully compliant with the COM Express Type 7 pinout, delivering very high speed interfaces, like up to x32 PCIe lanes, two 10Gbps (10GBASE-KR) and one 10/100/1000Mbps Ethernet port (1000BASE-T). Other interfaces include two SATA 3.0 ports, four USB 3.0 and four USB 2.0 ports.

Supported operating systems include Yocto Linux and CentOS; moreover, the CPU-162-23 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT Edge Gateways.

Professional Services are available for the CPU-162-23, starting from BIOS personalization and include carrier board design, system development and production. Deep module customization, such as feature changes are also available.

FEATURES:

HPEC and Microserver Ready – Combines up to 16 cores with a rugged design to enable High Performance applications even in the field

Powerful – Supports the latest generation of embedded Intel Pentium and Xeon D-1500 CPUs to deliver a server-class module

Up to 64GB ECC RAM – Supports up to four SO-DIMM sockets for ECC and non-ECC memory, to allow server-class applications

Two 10Gb Ethernet – Complies with COM Express Rev 3.0 Type 7, providing high speed interfaces such as two 10GbEthernet ports and up to x32 PCIe lanes

Rugged and Fanless – Operates from – 40 to +85°C, with error correcting code memory and low power variants for fanless design

Customizable – Comes with optional personalization and full customization services, ranging from factory options to deep HW/SW configuration changes

Professional Services – Provides the foundation for Eurotech Professional Services that span from carrier board development to complete system design, certification and manufacturing

The CPU-163-15 is a rugged COM Express module designed to meet the requirements for industrial and rugged fanless applications.
Compliant with PICMG COM Express R2.1, Type 10, the CPU-163-15 is a 84x55mm (Mini) form factor module based on the Intel Atom E3800 processor family, with 1 to 4 cores, up to 4GB ECC RAM and up to 32GB eMMC.
With ECC soldered down memory and flash storage, the CPU-163-15 is the ideal hardware platform for applications requiring long life cycle, resistance to vibration and reliable data storage, even in extended temperature.
Supported operating systems include Windows 10 IoT Enterprise and Linux; moreover, the CPU-163-15 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/ OSGi middleware for IoT Edge Gateways.
Professional Services are available for the CPU-163-15, starting from BIOS personalization and including carrier board design, system development and production. Deep module customization, such as feature changes are also available.

FEATURES:
Powerful – Comes with Intel Atom E3800 CPU: one, two and four core configurations, up to 1.91GHz

Mini – Complies with PICMG COM Express R2.1, with a 84x55mm (Mini) form factor and a Type 10 pinout
Reliable – Offers memory configurations up to 4GB with ECC

Rugged – Supports wide operating temperature (-40 to +85°C), conformal coating options, soldered memory and flash storage

Low Power – Enables fanless designs with a CPU TDP starting from 5W

Professional Services – Cuts Time-To-Market with Eurotech Professional Services, which include deep module customization, BIOS personalization, carrier board and system design and production

IoT Native – Provides native support for IoT, including IoT middleware and access to Eurotech IoT Integration Platform