ATX Form Factor Evaluation Carrier Board for COM Express Revision 3.0 Type VII Module
-4x 10GbE and 1x GbE
-10G PHY: Inphi CS4227
-32x PCIe Lanes
-2x SATA 3.0, 2x COM (Tx/Rx Only), 4x USB 3.0
-1x I2C, 1x SMBus, 4x GPIO
-BMC AST2500 Support
Intel Atom® C3000 based Type 7 COM Express Module
-Based on new COM Express Type 7 pinout with Intel Atom® processor C3000 series
-DDR4-2133/2400 ECC/Non-ECC SDRAM on Three SO-DIMM Sockets, up to 96GB
-4x 10GbE KR
-4x USB 3.2 Gen 2, 4x USB 2.0, 2x SATA III, 1x PCIe Gen 3 x8, 2x PCIe Gen 3 x2, 3x PCIe Gen 2 x1
-Wide-Temp (-40℃ to 85℃) on Selected SKUs
A range of industry applications face escalating demand for high-performance embedded computing. More specifically, this growing demand is for solutions built on standard hardware form factors with low power consumption and modularity in mind. At the same time, compact and efficient computer-on-modules (COMs) have evolved to support some of the most sophisticated embedded processors to manage heavier workloads than previously possible using the form factor. This cross section of modern high-performance embedded computing requirements coupled with a maturing COMs technology and supplier landscape is fueling its expansion into a variety of relatively new product designs and applications.
