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The COM Express® module COMe-bEP7 based on AMD EPYC™ 3000 series processors extends Kontron’s product family of server-grade COM platforms. The COMe-bEP7 is headless and a cost efficient option for applications requiring high processing power such as Medical Imaging and Servers.

The COMe-bEP7 is a high performance module with scalable performance up to 16 cores. The module supports an optional four SODIMM sockets with up to 128GB memory as well as four 10Gb Ethernet ports. The COMe-bEP7 is offered for either commercial or extended temperature ranges.

Up to 64 GByte DDR4 memory (2x 32 GByte dual-channel DDR4 SO-DIMM)
Up to 8 PCIe lanes (4x PCIe 3.0 (up to 8 GT/s) 4x PCIe 2.0 (up to 5 GT/s))
Optional up to 1 TByte NVMe SSD onboard
Industrial grade versions available

The COMe-bCL6(R E2S) offers increased performance density together with excellent graphic support on a standardized Type 6 Computer-on-Module based on the COM Express basic form factor.

Through the use of consistent COM Express connectors and feature implementation, the COMe-bCL6 is easily exchangeable and offers the most flexibility for customers designing it into their embedded devices based on individual carrier boards.

Especially the introduction of a hexa core CPU, memory expansion to possible 128GB, additional NVMe SSD onboard and the continuation of the Intel® Optane™ fast memory support for system acceleration shall be a differentiator to former applications.

Typical application areas can be found in markets such as communication, digital signage, professional gaming and entertainment, medical imaging and surveillance and security as well as industrial plant and machine line control on shop floor- and control room-level.

In addition the rugged R E2S modules – which offer Rapid shutdown functionality, ECC memory support and industrial grade temp. range usage – meet the special requirements of applications for the Military/Defense and Transportation market.