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The MSC C10M-BTC module is based on Intel‘s multi-core system-on-chip (SOC) Atom generation that integrates processor core, graphics, memory, and I/O interfaces into one solution. Based on 22nm processor technology it provides outstanding computing and graphics power and highest power efficiency. The outstanding feature of the MSC C10M-BTC is a USB 2.0 client interface. It also offers dual independent display support, DirectX 11.1 and fast DDR3L memory on a very compact, power saving and cost-efficient COM Express Mini module. Different SOCs with single-, dual- and quad-core processors are supported as well as an extensive set of interfaces and features. Optionally it offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). Type 10 pin-out supports USB 3.0 and digital display interfaces like DisplayPort, HDMI and DVI. The rugged design with soldered memory, optional ECC support and extended temperature range opens new application areas.

Intel Atom E3845 quad-core 1.91GHz, 10W
Intel Atom E3827 dual-core 1.75GHz, 8W
Intel Atom E3826 dual-core 1.46GHz, 7W
Intel Atom E3825 dual-core 1.33GHz, 6W
Intel Atom E3815 single-core 1.46GHz, 5W
Intel Atom E3805 dual-core 1.33GHz, 3W (no graphics)
Intel Celeron N2930 quad-core 1.83GHz, 7.5W
Integrated Intel Gen. 7 HD graphics
Up to 8GB DDR3L SDRAM, ECC opt.
Two SATA 3Gb/s mass storage interfaces
eMMC SSD (optional)
DisplayPort/HDMI/DVI interface
LVDS/Embedded DisplayPort interface
Two independent displays supported
DirectX 11.1, OpenGL 3.2, OpenCL 1.1
One USB 3.0/2.0 and four USB 2.0 interfaces
One USB 2.0 client interface
Two UARTs
Trusted Platform Module (option)
Extended temperature variants

COM Express Type 6 Compact module based on 11th Gen Intel® Core™ processor family (code name “Tiger Lake”) and soldered down memory

– Embedded/Industrial use condition
– Extended temperature options available
– PCI Express Gen 4
– Up to 32 GByte dual channel LPDDR4X soldered down memory with 4266 MT/ s IBECC
– AI/DL Instruction Sets including VNNI

The COM Express® module COMe-bDV7 based on the Intel® Atom® processor C3000 series extends Kontron’s product family of server-grade COM platforms. The COMe-bDV7 as an entry level platform is as a complementary product to the high performance class COMe-bBD7 equipped with the Intel® Xeon® processor D-1500 series. The COMe-bDV7 module features scalable CPU performance with up to 16 cores. This robust performance is combined with support for up to four 10GbE-KR ports making it ideal for network intensive implementations. The KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) on the base board in conjunction with a suitable PHY. Furthermore the available NC-Si signals allow for the connection of a Baseboard Management Controller (BMC) on the baseboard for the purpose of enabling out-of-band remote manageability. This enhances reliability and helps reducing the overall operating cost in general.

In addition, the COMe-bDV7 offers high-speed connectivity from configurable PCIe Gen3.0 lanes for high I/O performance demands. Offering a well-balanced multi-core CPU versus memory-size approach, it supports up to 64GB ECC or non-ECC DDR4 memory via two SODIMM sockets, optionally up to 128 GB via 4 SODIMM sockets .

An added advantage for developers is the optional integration of Kontron’s embedded Security Solution APPROTECT based on WIBU Systems technology.