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Acromag’s XCOM-6400 is a basic size platform (95 x 125mm) processor module with Type 6 interconnects. Several models are available with the 4th generation (Haswell) Intel Core i7 or i5 CPUs. Designed for industrial and defense applications, the XCOM-6400 has an extra rigid PCB and extended temperature support.

The 4th generation of Intel’s i5 and i7 processors delivers many enhanced capabilities for media, graphics, security, and power management. Huge performance improvements were made for floating-point-intensive computations which are critical for digital signal and image processing applications such as radar and sonar. Enhanced graphics enable smoother playback of high quality images for digital signage or displays. Better power efficiency reduces heat and allows smaller, lighter designs with more portability.

Cutting-edge technology features programmable power limits, allowing the user to “dial-down” the maximum power consumption of the CPU in systems where power is a concern.

This module sets a new standard for shock and vibration by implementing a SODIMM hold down mechanism. Soldering down the memory is no longer necessary.

The XCOM-6400 also provides a heat sink capability not available on traditional COM Express designs. Conduction-cooled rails set a new standard for carrier cards.

Supports Type 6 COM Express module, Single/dual PMC/XMC sites, High-density, high-speed connector

Acromag’s ACEX-4600 Type 6 COM Express carrier cards employ a number of key features that are critical for successful use in the rugged environments of defense/industrial applications.

High-density connectors (Samtec® SEARAY™) provide all field connections to standard I/O, CPU, and PMC/XMC module(s). This connector offers both a high-density (500 connections) and high-speed interface (10GHz) required to support Type 6 COM modules. The SEARAY connector supports both board-to-board and cable interfaces.

These carrier cards are ready for conduction cooling. Developers can install a CPU, carrier and expansion boards into a completely sealed enclosure. Acromag has developed a heat dissipation approach that meets the cooling needs of all three components.

Another vital feature is the on-board DC/DC power supply. The carrier card operates from a single external 10–32V DC power source. All internal supply voltages are derived from this single external DC power source and built onto the carrier card.

For easier development and testing, Acromag offers an engineering design kit with a break-out board that routes all I/O signals from the carrier’s high-density connector to standard peripheral connectors. Production front panels with MIL-DTL-38999 cylindrical connectors and a conduction cooling kit prepare the carrier card for field deployment.

Please contact the factory for lead solder option.

For easier testing and development, Acromag offers an engineering development system to streamline your COM Express® system for fast field deployment.

The engineering development system is an engineering development board and an ACEX-4610-LF or ACEX-4620-LF COM Express® carrier board mounted to a metal baseplate.

The engineering development system is an engineering development board and an ACEX-4610-LF or ACEX-4620-LF COM Express® carrier board mounted to a metal baseplate.

To ensure proper air circulation two fans are mounted to the baseplate forcing air across the one/two XMC/PMC sites. The development board allows access to all signals delivered from the carrier card’s Samtec® SEARAY™ high-density connectors through to the I/O breakout board connectors. The breakout board provides all standard peripheral I/O from the CPU, I/O expansion modules, and accommodates two SSD devices for program storage. The I/O breakout board has two power supply connections for a choice of the included 24V DC (160W) brick-type power supply or your own external power adapter.