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PCOM-B645VGL, a Type 6 compact COM Express® (95 x 95 mm) module which based on Intel® Elkhart Lake Atom® x6000 and Pentium® N and J Series Processors. In this architecture, it could provide VGA, LVDS, and high quantity HDMI, eDP, DP with 4K resolution, and three independent displays. And it also provides turbo mode up to 3.0GHz, with extending 5 x PCIe 3.0 x 1, 2 x USB 3.1, 8 x USB 2.0, and 2 x SATA III devices. With ultra low power consumption(4.5 to 12W), wide-temp support, it could provide very energy saving and high effective performance. Portwell want to promotes PCOM-B645VGL as vertical solution to aim in the different versatile applications, such as automation, healthcare, retail, transportation and so on.

Features:
1.Intel® Atom® Processor x6000 Series (Elkhart Lake)
2.DDR4 SDRAM up to 32GB with IBECC
3.Optional for -40°C to 85°C Industrial temperture
4.Multiple Displays VGA, LVDS, eDP/DP, HDMI
5.Support Intel® TCC/TSN with 2.5GbE

Rugged COM Express, based on PICMG standard COM.0 or COM Express, has been developed for demanding embedded applications with extended requirements for thermal design, shock, vibration and EMC. Rugged COM Express, together with an application-specific carrier board, forms a semi-custom solution which is suited for application in extremely harsh, mobile and mission-critical environments.

The XC15 is an evaluation and development platform that can be used together with any type of Rugged COM Express module. The XC15 provides physical interfaces and connectors for nearly all current serial standard I/Os, which can be routed from the COM Express connectors to the carrier board. The XC15 comes with one COM Express slot and eight PCI Express card slots, including an onboard PCI Express Graphics (PEG) interface on a standard PCIe x16 connector. In addition, it provides three display ports, four onboard SATA connectors, two LVDS and two CAN interfaces which are available via SA-Adapters.

The functionality of all connectors depends on the Rugged COM Express module used on the XC15. It supports the Micro ATX form factor and can therefore operate in a PC system. Additional USB ports on the front panel for USB driven Flash disks for application storage, complement the memory configuration that is already available on the different COM Express modules.

For a first evaluation of the functions and performance of the Rugged COM Express module of choice, we strongly recommend using the XC15. Further useful accessories include an external PSU, a heat sink and fan, a DisplayPort to DVI adapter, and cables for UART and SATA HD.

ADLINK Express-ID7 Key Features:
• Intel® Xeon® D-1700 Processor
• Up to 10 cores, 15MB cache
• Edge AI (Intel® AVX-512 & VNNI)
• 4x 10G Ethernet
• 16 PCIe Gen4, 16 PCIe Gen3 lanes
• Industrial-grade reliability

ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.

Built for rugged and edge AI applications, this ADLINK COM with Intel® Ice Lake-D empowers system integrators to realize all of their IoT innovations, from edge networking, unmanned aerial vehicles, autonomous driving, robotic surgery, to rugged HPC servers, 5G base stations, automatic drilling, ship management, and more.