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The ITX-M-CC452-T10 is an industrial Mini-ITX small form factor Type 10 carrier board designed to fully test WINSYSTEMS’COMeT10-3900 COM Express Type 10 Mini module. The carrier board adheres to the PICMG COM Express specifications providing compatibility with other COM Express mini type 10 modules.

This full-featured carrier board supports two independent video displays (DisplayPort and LVDS/eDP), dual Ethernet, two USB 3.1 Gen 1 ports, two USB 2.0 ports, four general purpose inputs, four general purpose outputs, stereo audio, and a watchdog timer.

The board also includes expansion capabilities via three Mini-PCIe sockets (one with mSATA support), M.2 M-key 2280 with support for PCIe x4 NVMe SSD drives, and a SATA port for external SSD’s.

The ITX-M-CC452-T10 is a fully production-ready platform and is a versatile and easily configured solution with customizable COM module, storage, and I/O options to suit the industrial use case. With design details available, the ITX-M-CC452-T10 is also an excellent reference design and evaluation carrier board for WINSYSTEMS Type 10 COM Express modules.

INDUSTRIAL CARRIER DESIGN
• Mini-ITX Small Form Factor
• Made in the USA
• -40°C to +85°C Operating Temperature Range to help verify against your COMe T10 designs
• Wide Range Power Input (9-20 V DC)
• Supports all interfaces on the WINSYSTEMS COMeT10 modules

GRAPHICS
• Supports up to Two Independent Displays
• 1x DisplayPort with 4K Resolution
• 1x LCD with backlight and touch control

CONNECTIVITY AND I/O
• 2x Gigabit Ethernet
• 2x USB 3.2 Gen 1 and 2x USB 2.0
• 4x General Purpose Input (GPI)
• 4x General Purpose Output (GPO)
• 4x Serial Ports (2x RS232, 2x RS232/422/485)
• HD Audio

STORAGE
• microSD
• SATA with SATA Power
• mSATA

EXPANSION AND CONFIGURATION OPTIONS
• 3x Mini-PCI Express (1x with mSATA support)
• M.2 M-key 2280 with support for PCIe x4 NVMe

The MSC C6C-ALP COM Express module features the 12th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. The module is ideal for applications such as in medical equipment, process control, HMI terminals, transportation, and intelligent kiosk, that require outstanding performance on a small form factor. The Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to twelve cores and sixteen threads at 28W thermal design power (TDP). For applications with need for lower power dissipation, selected processor variants can be operated down to 12W TDP.

For highest data throughput the module enables fast LPDDR5-5200 memory technology. Carried out as memory-down, the board can be assembled with up to thirty-two GB main memory. I/O located on COM Express carrier designs can be connected to the module via up to eight PCIe Gen 3 lanes and four lanes PCIe Gen 4. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i226 network controller. System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

PCOM-B657VGL is a COM Express module based on Intel® 11th Gen H Processor, which is compatible with COMe 3.0 standard. The platform adopt 10nm++ process and support VNNI instruction set, offers advance computing power with 45W~25W thermal and industrial grade power management.

Features:
1.11 Gen Intel® Core™, Celeron®, and Xeon® W-11000E Series processors in 10nm Super Fin Process technology
2.AI/DL Instruction sets Support (Intel VNNI, AVX-512, INT8, FP16)
3.Up to 8C/16T@45W and 25W with Industrial temperature SKUs
4.DDR4 SO-DIMM, PCIe Gen 4.0 x16, and 8x PCIe Gen 3.0 x1
5.Complete Support of 3x DDI, eDP/LVDS, and VGA
6.Support Intel® TCC/TSN with 2.5GbE