Archives

November 4, 2022

COM Express Type 6 Carrier Board – TEVAL2

Get your COM Express project off to a fast start with the TEVAL2 COM Express carrier board. The TEVAL2 supports Basic and Compact Type 6 COM Express modules. Standard features include six PCI Express X1 slots, one PCI Express X4 slot, one PCI Express (PEG) X16 slot, one Mini PCI Express slot, one Express Card socket, and one SD Card socket. The carrier board includes connectors for digital and analog video, USB, Ethernet, SATA, GPIO/SDIO, serial and audio interfaces. Specific features are COM Express module dependent.

The TEVAL2 carrier board simplifies software development and prototyping while the target application carrier board is designed. Take advantage of Sealevel’s carrier board development services for the fastest time to market. Our extensive library of proven I/O circuits including serial, analog, and digital functionality simplifies the design process, which can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application.

Turn to Sealevel’s custom capabilities for expertise in electrical, mechanical, software, environmental stress screening, project management, compliance & certification. Call us today to discuss the design capabilities, reliability improvements and design control advantages that a Sealevel COM Express carrier board or system design will bring to your next product.

COM Express Type 6 reference carrier board

Supports Basic and Compact Type 6 COM Express modules

Includes various I/O options

Simplifies software development and prototyping

Specific features are COM Express module dependent

November 3, 2022

Sealevel 12009 COM Express Compact Type 6 Evaluation Board

The 12009 COM Express Compact Type 6 Evaluation Board enables accelerated development of embedded computing prototypes, dramatically expedites electrical hardware engineering, and reduces costs for new product introductions (NPIs). At 95 millimeters square, the 12009 Compact Evaluation Board is identical in size to a Compact Type 6 COM Express module.

Standard I/O includes Gigabit Ethernet, USB 3.0, USB 2.0, GPIO, RS-232, and Mini DisplayPort. The 12009 evaluation board is designed for the congatec® conga-TC370 COM Express family, with support for 8th generation Intel® Core™ processors, up to 64 GB DDR4 RAM, and TPM 2.0 support.

The complete evaluation kit (Part #12009-001-KT) includes a Type 6 module with Intel Core i3-8145UE CPU and 8 GB DDR4 RAM. Additionally, to improve the development process, the kit includes a 128GB M.2 SATA SSD module (supports Windows® and Linux® operating systems), a desktop power supply, and a wide variety of cables to facilitate connections to serial and Ethernet ports and optional fans. Power button and power-indicating LED also included.

The 12009 COM Express Type 6 Evaluation Board features a wide operating temperature range of 0ºC to 70ºC and is powered via a locking, four-position Molex Micro-Fit connector.

Turn to Sealevel’s custom solutions for expertise in electrical, mechanical, software, environmental stress screening, project management, and compliance & certification. Our extensive library of proven I/O circuits including serial, analog, and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges, and connector types required for your application.

What’s Included

Carrier board, COM module, and plexiglass demonstration enclosure

128GB M.2 SSD Installed

5V Fan with 5 Pin Molex Connector Cable Installed in Enclosure

Molex Connector to 2 DE9 Connectors Cable

(2) 10-Position Connector to RJ45 Cables

Power Button and LED Cable

(2) Pin to 4 Pin Molex Cables, 14.00″ (Item #CA471)

10-Position Connector to Flying Leads, 11.81”

(2) SeaLATCH Panel Mount USB Type A Female to Molex 4 Pin Connectors

Mini DisplayPort Male to HDMI Male Cable, 3′

60W, 21V Power Supply

October 25, 2022

COM Express Type 10 Mini Module

The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel® Atom™ E3900 processor. This low power industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board containing user specific I/O requirements.

COM Express modules allow users to retain the same carrier board design across scalable CPU series and over multiple generations of COM Express modules, providing a long project lifetime. Updating a COM Express module to improve performance or replace an end-of-life processor drastically improves your time to market when revising existing projects. Users can choose the default BIOS settings and layout or request a custom-branded configurable BIOS to support specific project requirements.

The COMeT10-3900 supports Linux, Windows® 10, and other x86-compatible real-time operating systems. Drivers are available from the WINSYSTEMS website.

PERFORMANCE FOR INDUSTRIAL IOT
• Intel Atom E3900 Processor, formally Apollo Lake-I
• Up to 8GB LPDDR4 2400 MT/s System Memory
• Intel Low Power Gen9 Graphics Engine
• Full-HD and 3D Graphics acceleration

SECURITY
• On-board Discrete TPM 2.0 Hardware Security

RUGGED DESIGN
• -40°C to +85°C Operating Temperature Range
• COM Express Type 10 Mini, Small Form Factor
• Wide Range Power Input (4.75V – 20V DC)

EXPANSION
• 4x PCIe lanes configurable as 4×1 (Default), 2×1 + 1×2, or 1×4
• 2x USB 3.1 Gen 1, 6x USB 2.0
• 1x i210 1Gb/s Ethernet RGMII with IEEE 1588 support
• HD Audio
• 2x SATA III (6 Gb/s)
• 2x UART
• 4x GPI, 4x GPO (SDIO option for MicroSD socket)

STORAGE
• On-board eMMC 5.x (8GB to 128GB)

DISPLAY
• 1x Dual Mode Display (DisplayPort, HDMI, DVI)
• 1x eDP (optional single channel LVDS)

SOFTWARE SUPPORT
• Custom configurable UEFI-based AMI BIOS
• System Management Libraries and Tools
• EAPI v1.1 support for System Info, WDT, I2C, Brightness, GPIO, and User Storage Area