Archives

January 19, 2023

MSC C6B-RLP

The MSC C6B-RLP COM Express module features the 13th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance the module is ideal for compute intense applications in industrial, medical, transportation, video surveillance and gaming. The Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP) and can go as low as 12W TDP. Selected variants of the processor provide TSN and Intel® TCC enabling extended real-time capabilities, allow continous running (24/7) and support module variants to operate in extended temperature range.

For highest data throughput the module enables fast DDR5-4800 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to sixty-four GB. I/O located on COM Express carrier designs can be connected to the module via eight PCIe lanes (mix of Gen 4/3) and an eight lane PEG port capable of PCIe Gen 4. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i226 network controller. System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

January 19, 2023

MSC C6C-ALN

The MSC C6C-ALN features the Intel® Atom® processors x7000E Series, Intel® Core ™i3 processor and Intel® Processors N Series. The CPU architecture is based on the same Efficient-cores and Intel® UHD graphics driven by Xe architecture as the 12th Gen Intel® Core™ processors, thus easing up application migration across Intel® CPU performance and power ranges. With support for up to eight processor cores, the module fits to a wide range of applications including point-of-sales terminals, digital signage controllers, HMI solutions and medical equipment.

The MSC C6C-ALN can drive up to three independent displays with a maximum of 4k resolution. The COM Express Type 6 interface allows direct access to digital display interfaces including DisplayPort, HDMI, VGA, and the choice of LVDS versus eDP. With a maximum capacity of 16GB fast DDR5 memory the board satisfies even demanding applications. Optional in-band ECC capability allows for protecting code and data kept in memory. High speed IO includes up to six PCIe Gen 3 lanes and up to four USB 3.1 interfaces. Mass storage is provided with the optional on-board eMMC memory and externally accessible via up to two SATA channels. The network interface based on Intel® i226 supports up to 2.5GbE bandwidth. System investments are well protected through long term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

January 6, 2023

conga-TC675

COM Express Type 6 Compact module based on 13th Gen Intel® Core™ embedded mobile processors (code name “Raptor Lake”)

– Intel® hybrid design combines Performance-cores with Efficient–cores
– Up to Intel® Iris® Xe Graphics architecture with up to 80 EUs
– PCI Express Gen 4 | USB 3.2
– AI Acceleration with Intel® Deep Learning Boost (VNNI)
– Embedded Use Condition SKUs