Archives

December 19, 2023

COM Express Type 6 Compact Module

The COMeT6-1100 is an industrial COM Express® Type 6 Compact module with an Intel® 11th Gen Intel Core™ i3/i5/i7 Processor.
This industrial module is designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine
that can be plugged onto a carrier board containing user-specific I/O requirements.

COM Express modules allow users to retain the same carrier board design across scalable CPU series and over multiple generations
of COM Express modules providing a long project lifetime. Updating a COM Express module to improve performance or replace an
end-of-life processor drastically improves your time to market when revising existing projects. Users can choose the
default BIOS settings and layout, or request a custom-branded configurable BIOS to support specific project requirements.

INDUSTRIAL COM EXPRESS MODULE
• Form Factor: COM Express Type 6 Compact – 3.75 in x 3.75 in (95 mm x 95 mm)
• Made in the USA
• 11th Gen Intel Core i3/i5/i7 Processor, formally Tiger Lake-UP3
• -40°C to +85°C Operating Temperature Range
• Up to 32GB LPDDR4 4266 MT/s System Memory, supporting IBECC
• Standard 12 VDC Input, +/- 10%

SECURITY
• On-board Discrete TPM 2.0 Hardware Security
• vPro support on i5 and i7 CPUs Display and Graphics
• Intel Gen12 Graphics Engine, with up to 96 EUs
• Up to 4 simultaneous and independent displays
• 3x Digital Display Interface (DDI) to DisplayPort++ / HDMI / DVI
• 1x eDP (optional dual channel LVDS)
• 1x VGA (optional)

NETWORK
• 1x 2.5G Network via Intel i226 Controller
• TSN support

STORAGE
• 2x SATA III (6Gb/s) Interfaces to Carrier

CONNECTIVITY AND I/O
• PCIe Gen4 x4 for PEG or NVMe
• 5x PCIe Gen3 configurable as 4×1 (Default), 2×1 + 1×2, or 1×4
• 4x USB 3.2 Gen 1, 8x USB 2.0
• HD Audio
• 2x UART
• 4x GPI, 4x GPO

SOFTWARE
• Windows10, Ubuntu, Red Hat
• Custom configurable UEFI-based AMI BIOS
• System Management Libraries and Tools
• EAPI v1.1 support for System Info, WDT, I2C, Brightness, GPIO

December 19, 2023

conga-TC700

COM Express Type 6 Compact module based on Intel® Core™ Ultra processors (code name “Meteor Lake”)

December 19, 2023

COM Express Type 6 Evaluation Carrier Board

The ATX-M-CC462-T6 is a fully featured COM Express Type 6 evaluation carrier board designed for use with the WINSYSTEMS Intel® Tiger Lake UP3 COM Express and other COM Express Type 6 modules. The carrier implements the full capabilities of the Type 6 connectors extant on the WINSYSTEMS COMeT6-1100 COM Module and is compliant with PICMG® COM.0 Rev 3.0 Specifications.

The ATX-M-CC462-T6 is a standard, MicroATX form factor COM Express Type 6 carrier board that is compatible with the WINSYSTEMS COMeT6-1100 COM Express Type 6 Intel Tiger Lake UP3 design or other compliant COM Express Type 6 boards.

Industrial Evaluation Carrier Design:
• Micro-ATX form factor: 9.6 x 9.6 inches (244 x 244mm)
• Made in the USA
• -40ºC to +85ºC with supporting cooling options
• ATX Mode: Standard ATX Power input
• AT Mode: 12VDC +/- 5%
• Supports all interfaces on the WINSYSTEMS COMeT6 Modules

Graphics:
• Support for Dual Channel LVDS and eDP, including backlight

Connectivity and I/O:
• 4 x USB 3.2 Gen1 (2x Front Panel Type A, 2x Header)
• 4 x USB 2.0 (2x Front Panel, 2x Header)
• 2 x RS 232 2pin (Tx/Rx) from COMe Module
• 2 x RS232/422/485 Multiprotocol Legacy mode

Storage/SATA Channels:
• 4x SATA Type III (6Gb/s) channels

Expansion and Configuration Options:
• 3x Mini-PCI Express (1x with mSATA support)
• M.2 M-key 2280 with support for PCIe x4 NVMe

Software:
• Windows 10 and 11
• Linux