Archives

August 27, 2024

PBN-9007: COM Express® Mini Type 10 Carrier Board

PBN-9007 Features
-COM Express® Type 10 Carrier Board
-Single Channel 24-bit LVDS, and DisplayPort
-Soldered onboard Touch Screen Controller
-Wide Range Operating Temp.: -40 ~ 85°C

April 2, 2024

COM Express Type 7 Development Kit based on AMD Ryzen™ Embedded V3000 Processor

ADLINK COM Express Type 7 Dev Kit Key Features:
• Express-VR7 module powered by AMD Ryzen™ Embedded V3C18I processor
• Express-BASE7 carrier board
• Supporting up to 64GB DDR5 at 4800MT/s SO-DIMM memory
• 10GbE Ethernet Adapter Card (SFP+ or 10GBASE-T)
• 14x PCIe Gen4, USB 3.x/2.0, SATA 6Gb/s, UART, GPIO
• Industrial-grade quality and 10-year+ product availability
• Operating temperature: 0°C to 60°C

The COM Express Type 7 Ryzen V3000 is a power-efficient COM Express Type 7-based development kit powered by AMD Ryzen™ Embedded V3C18I 8-core/16-threads SoC with under 15W TDP and comprehensive high-speed interfaces.

Performance and power-efficiency-focused, this kit features a COM Express module with AMD’s advanced “Zen 3” CPU architecture, harnessing 8-cores and 16-threads at a power consumption of mere 15W. It provides superior performance and power per watt with high flexibility in realizing a wide range of Edge application. With its PCIe Gen4 and integrated 2x 10G Ethernet LAN and 1x 2.5G Ethernet LAN, it exhibits outstanding responsiveness, making it suitable for mission-critical applications requiring high-performance and low power consumption, such as edge networking equipment, cyber security, 5G infrastructure at the edge, and industrial automation and control.

April 2, 2024

cExpress-ALN COM Express Compact Size Type 6 Module with Intel® 7th Gen. Atom® x7000E, Core™ i3 and N Series Processors (formerly Alder Lake-N)

ADLINK cExpress-ALN Key Features:
• Up to 8 cores, up to 16GB LPDDR5 at 4800 MT/s
• 2x 2.5GbE Ethernet, TSN capable
• PCIe Gen3 lanes, USB 3.2 10Gbps
• 3x 4K display
• Real Time I/O (GPIO, UART, I2C)
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option).