Archives

July 12, 2018

Express-BL: COM Express Basic Size Type 6 Module with 5th Gen Intel Core and Xeon Processors (formerly codename: Broadwell)

Key Features
– 5th Gen Intel Core and Xeon Processors (formly codename: Broadwell)
– Up to 32GB dual channel DDR3L at 1600 MHz
– 3x DDI channels, one LVDS and VGA, support up to 3 independent displays
– Seven PCIe x1 and one PCIe x16
– GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions
– Extreme Rugged operating temperature:-40°C to +85°C (build option)

July 12, 2018

cExpress-KL: COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)

Key Features
– 7th Generation Intel® Core™ and Celeron® Processors
– Up to 32GB Dual Channel DDR4 at 1867/2133MHz
– Supports up to 3 independent displays in combinations of DDI, LVDS, VGA, eDP
– GbE, up to 6 PCIe x1 (build option)
– Three SATA 6 Gb/s, four USB 3.0 and four USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions
– Extreme Rugged operating temperature: -40°C to +85°C (build option)

February 16, 2017

uCOM-SL6C

COM Express Type 6 Module with 6th Generation Intel® Core™ Processors

KEY FEATURES

• 6th Gen Intel® Core™ i7/i5/i3/Celeron w/ integrated PCH-LP
• Support Dual Channel DDR3L-1600 SODIMM up to 32GB
• Flexible PCI Express up to 8 lanes
• COM Express Compact Type 6 module 95×95 mm
• 4x USB 3.0, 8x USB 2.0, 3x SATA, 2x Serial
• uManager / uETT / Dual BIOS / FOTA
• Standard operation temperature: -20°C to +70°C
• Extended operation temperature (upon request): -40°C to +85°C (opt.)