– AMD Embedded Ryzen 7nm SoC – V2000 APU
– COM Express® R3.0 Compact Module Type 6 Pinout
– Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC)
– High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0
– Four Display (DP++, HDMI, VGA, LVDS)
– Supports iManager, Embedded Software APIs and WISE-DeviceOn
COM Express Compact Type 6 module with Intel Atom® E3900 series, Pentium® and Celeron® processors
– supports up to 3 independent displays up to 4k resolution
– DDR3L up to 8GByte (1866MT/s) dual channel memory
– optional eMMC 5.0
– industrial temperature range support from -40 to +85 degrees for selected CPU versions
Features:
-11th Generation Intel® Core™ processorsdelivering high performance and lower power
-DDR4 3200 MT/s up to 64GB
-PCI Express 4.0/3.0
-Rich I/O including 2x serial ports, 4x USB 3.2Gen 2, 8x USB 2.0, 2x SATA 3.0 ports
-Four independent displays
-On-board TPM 2.0
-Wide operating temperature -40ºC to 85ºC option available
Portwell’s PCOM-B656VGL is designed with latest 11th generation Intel® Core™ processor (Codenamed Tiger Lake-UP3) and integrated Xe graphics,optimized computing performance and faster graphics performance with the support of DDR4 memory, one PCIe Gen 4 x4, one PCIe Gen 3 x4, one PCIe Gen 3 x1, four USB 3.2 Gen 2, two SATA III, and four displays.
PCOM-B656VGL is compatible with COM Express 3.0 Type 6 carrier board. Customer can easily and quickly test the new COMe module with Portwell’s carrier boards and develop application. Portwell is also able to provide services to the custom carrier board design, development and manufacture.
