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COMe-C55-CT6

COMe-C55-CT6, a COM Express™ 3.0 Compact Type 6 module with the 8th Gen Intel® Core™ U-series processors with 15W TDP. Designed as a low power multi-core Intel® architecture for mobile applications, it features an Intel® UHD Graphics 620 and, in terms of connectivity, comes with 4x USB 3.1, 8x USB 2.0, and most notably, up to 8x PCI-e x1 lanes. The memory consists of two DDR4 SO-DIMM slots supporting DDR4-2400 (up to 32GB). It excels in versatility, being capable of delivering on its promises in a wide number of fields such as biomedical and medical devices, digital signage & infotainment, edge computing, HMI, info kiosks, measuring instruments, and transportation.

CPU-161-17

The CPU-161-17 is a rugged COM Express module designed to deliver intense computation while meeting the requirements for industrial and rugged fanless applications.
Compliant with PICMG COM Express R2.1, Type 6, the CPU-161-17 is a 95x95mm (Compact) form factor module based on the 6th Generation Intel Core processor family (i7, i5, i3 and Celeron), with two cores and up to 16GB SO-DIMM RAM.
Other features include high speed interfaces: one Gbit Ethernet, three SATA 3.0 with RAID support, four USB 3.0 and eight USB 2.0, eight PCIe Gen 3 lanes, and three independent video ports (LVDS, VGA and DDI supporting up to 4096×2304@60Hz).
The CPU-161-17 is a solid building block for projects where reliability in harsh conditions is mandatory, and long term availability is a must, thanks to an operating temperature of -40 to +85°C, support for RAID 0/1/5, optional conformal coating and long term support/lifecycle programs.
Supported operating systems include Windows 10 IoT Enterprise and Linux; moreover, the CPU-161-17 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT gateways.
Distributed and supported by Eurotech, ESF adds advanced security, diagnostics, provisioning, remote access and full integration with Everyware Cloud (EC), Eurotech IoT integration platform (separately available).
Professional Services are available for the CPU-161-17, starting from BIOS personalization and including carrier board design, system development and production. Deep module customization, such as feature changes are also available.

FEATURES:

Powerful – Comes with 6th Gen Intel Core CPUs: Core i7, i5, i3 and Celeron dual core configurations, up to 2.6GHz (3.4GHz burst)

Compact – Complies with PICMG COM Express R2.1, with a 95×95 (Compact) form factor and a Type 6 pinout

Rich – Delivers multiple interfaces, including three independent video ports, 8 PCIe lanes, three SATA interfaces with RAID and much more

Rugged – Supports wide operating temperature (-40 to +85°C) and conformal coating options

Low Power – Enables fanless designs with DDR3L and a CPU TDP of only 15W

Professional Services – Cuts Time-To-Market with Eurotech Professional Services, which include deep module customization, BIOS personalization, carrier board and system design and production

IoT Native – Provides native support for IoT, including IoT middleware and access to Eurotech IoT Integration Platform

CPU-161-18

The CPU-161-18 is a COM Express module that combines a high performance and truly embedded CPU with an innovative hybrid RAM architecture that offers the ruggedness of soldered memory and the expandability of SO-DIMMs.
The standard configuration provides 8GB of memory soldered directly on the PCB and supports up to 24GB DDR4 RAM with ECC error correction through a SO-DIMM slot, targeting use cases where extreme ruggedness is required, and those that need a large memory.The CPU-161-18 can be configured with any member of the Xeon/Pentium D-1500 family; standard versions support extended temperature CPUs, such as the Pentium D-1519 and the Xeon D-1559, closing the gap between traditional embedded applications and servers.
Compatible with existing Type 6 carrier boards, the CPU-161-18 is a headless unit that provides a fast upgrade path to existing projects and that allows the creation of new high-performance ones: a notable feature of this Compact size module is the availability of a x16 PCIe Gen 3 port in addition to the x8 one, a characteristic that is more commonly found only on larger modules; other features include: Gigabit Ethernet, four SATA 3.0 ports, four USB 3.0 and seven USB 2.0 interfaces.
Supported operating systems include Yocto Linux and CentOS; moreover, the CPU-161-18 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT gateways.
Professional Services are available for the CPU-161-18, starting from BIOS personalization and including carrier board design, system development and production. Deep module customization, such as feature changes are also available.

FEATURES:
HPEC and Microserver Ready – Combines computational power with a rugged design to enable High Performance applications even in-the-field

Powerful – Supports the latest generation of embedded Intel Pentium and Xeon D-1500 CPUs to deliver a server-class module

Hybrid RAM Architecture – Innovates by offering the reliability of soldered-down RAM and the expandability of SO-DIMMs

Compact Size with PCIe x16 Port – Complies with COM Express Type 6 Rev 2.1, including support for a PCIe x16 port

Rugged and Fanless – Allows robust, fanless designs thanks to 100% soldered-down components and with a range of energy efficient CPUs

Customizable – Comes with optional personalization and full customization services, ranging from factory options to deep HW/SW configuration changes