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The HeiSys system platform combines the advantages of existing and established plug-on modules and offers full scalability of computing power on the one hand and on the other hand, multidimensional modularity in terms of communication and I/O interfaces.

Depending on the application and the requirements for computing power, datarate, signal diversity and power consumption, suitable COM Express boards can be selected.
Together with a self-developed FPGA SMARC module a large variance of interfaces can be mapped. This allows the realization of vehicle/field buses such
as MVB, Profibus, CAN and EtherCat.
A wide choice of wireless standards is supported via multiple M.2 connectors. The system platform is designed for the use of Wi-Fi, GSM, UMTS, LTE, 5G, LPWAN, LoRaWAN, Wi-Fi, Bluetooth and GPS/GLONASS multiband radio modules for industrial and railway operations.

This eliminates the need for complicated, time-consuming assembly or the timeconsuming coordination of various components.
The compact system is certified for mobile use as a rolling stock or for wayside monitoring by the approval according to EN 50155. Due to the absence of moving parts such as fans, the reliability and the MTBF is significantly increased. The system guarantees operation in an extended temperature range between -40 °C and +85 °C.
The system platform is excellently suited e.g. for the medical, energy / transportation, industrial and digitalization sectors. The system can be used as a gateway, a passenger information system, a wireless-access-point or as diagnostic and monitoring system in the energy sector or transportation. In marine, trains or automotive applications HeiSys can be used as a board computer or for navigation.
HeiSys supports Windows 10 / IoT and all Linux distributions of current kernels. The concept uses main line drivers or the drivers provided by the corresponding modules to ensure proper commissioning and function.

Supports Type 6 COM Express module, Single/dual PMC/XMC sites, High-density, high-speed connector

Acromag’s ACEX-4600 Type 6 COM Express carrier cards employ a number of key features that are critical for successful use in the rugged environments of defense/industrial applications.

High-density connectors (Samtec® SEARAY™) provide all field connections to standard I/O, CPU, and PMC/XMC module(s). This connector offers both a high-density (500 connections) and high-speed interface (10GHz) required to support Type 6 COM modules. The SEARAY connector supports both board-to-board and cable interfaces.

These carrier cards are ready for conduction cooling. Developers can install a CPU, carrier and expansion boards into a completely sealed enclosure. Acromag has developed a heat dissipation approach that meets the cooling needs of all three components.

Another vital feature is the on-board DC/DC power supply. The carrier card operates from a single external 10–32V DC power source. All internal supply voltages are derived from this single external DC power source and built onto the carrier card.

For easier development and testing, Acromag offers an engineering design kit with a break-out board that routes all I/O signals from the carrier’s high-density connector to standard peripheral connectors. Production front panels with MIL-DTL-38999 cylindrical connectors and a conduction cooling kit prepare the carrier card for field deployment.

Please contact the factory for lead solder option.

COM Express™, an open specification of the PICMG (PCI Industrial Computer Manufacturer Group), is a module concept to bring PCI Express and other high speed serial technologies like SATA, USB and digital display interfaces on a COM (Computer On Module).

The MSC C6-MB-EVA is a versatile carrier board designed to evaluate and prototype system electronics before a customer specific baseboard is available. It provides the interface infrastructure for the COM Express Type 6 modules and offers various PC type connectors for external access. It can also help develop software in parallel with the hardware to speed up the integration process.

This universal platform allows you to quickly test and choose the right product from out COM Express portfolio

COM Express™ Type 6 Carrier Board
Socket for COM Express™ Type 6 modules in Basic or Compact form factor
One PCI Express x4 slot
Four PCI Express x1 slots
One PCI Express x16 PEG slot
Four SATA connectors
SD card socket
Four USB 3.0, four USB 2.0 interfaces
Two DisplayPort/HDMI connectors
VGA/DVI connector
LVDS interface
Embedded DisplayPort connector
HD audio codec; six audio jacks and SPDIF
LAN interface
mSATA and Mini PCI Express sockets
Various additional COM Express™ specific interfaces
ATX-style power connector / 12V-only jacks
POST code LED display
Size 305 mm x 244 mm (ATX form factor)