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The IBR-i7-3517UE COM Express Type 6 module features an Intel Core i7-3517UE dual-core 1.7GHz processor and supports up to 16GB of 1600MHz DDR3 RAM. The module offers low power consumption (TDP 8W) and can operate fanless over an extended operating temperature range of -40°C to 85°C ambient, while the 2.3mm thick PCB is ideal for high vibration environments. Standard features include integrated Gigabit Ethernet controller, up to seven PCI Express X1 lanes, one PCI Express X16, two SATA III (6Gb/s) interfaces, two SATA II (3Gb/s) interfaces, eight USB 2.0 ports, four USB 3.0 ports, LPC bus, SMBus and I2C bus. The module includes three Digital Display Interfaces (DDI) for DisplayPort, HDMI or DVI displays.

Sealevel specializes in COM Express carrier boards built to your specific application requirements. Our extensive library of proven I/O circuits including serial, analog, and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application. COM Express development boards are also available to allow software development to begin immediately while the custom carrier board is designed.

Turn to Sealevel’s custom capabilities for expertise in electrical, mechanical, software, environmental stress screening, project management, and compliance & certification. Call us today to discuss the design capabilities, reliability improvements and design control advantages that a Sealevel COM Express carrier board or system design will bring to your next product.

COM Express Basic with Type 6 connector layout

Includes 1.7GHz (up to 2.8GHz Turbo) Intel Core i7-3517UE dual-core processor

Maximum 16GB DDR3 1600MHz RAM via dual 204-pin SODIMM slots

Integrated Mobile Intel QM77 Express chipset

Variety of I/O interfaces can be included

Extended temperature operation from -40°C to 85°C ambient

PCOM-B657VGL is a COM Express module based on Intel® 11th Gen H Processor, which is compatible with COMe 3.0 standard. The platform adopt 10nm++ process and support VNNI instruction set, offers advance computing power with 45W~25W thermal and industrial grade power management.

Features:
1.11 Gen Intel® Core™, Celeron®, and Xeon® W-11000E Series processors in 10nm Super Fin Process technology
2.AI/DL Instruction sets Support (Intel VNNI, AVX-512, INT8, FP16)
3.Up to 8C/16T@45W and 25W with Industrial temperature SKUs
4.DDR4 SO-DIMM, PCIe Gen 4.0 x16, and 8x PCIe Gen 3.0 x1
5.Complete Support of 3x DDI, eDP/LVDS, and VGA
6.Support Intel® TCC/TSN with 2.5GbE

The MSC C6B-ALP COM Express module features the 12th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance the module is ideal for compute intense applications in medical, transportation, video surveillance and gaming. The new Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). For applications with need for lower power dissipation, selected processor variants can be operated down to 12W TDP.

For highest data throughput the module enables fast DDR5-4800 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to sixty-four GB. I/O located on COM Express carrier designs can be connected to the module via eight PCIe lanes (mix of Gen 4/3) and an eight lane PEG port capable of PCIe Gen 4. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i225 network controller. System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.