Archives

Key Features
– 6th Generation Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (codename: Skylake)
– Up to 32GB non-ECC Dual channel DDR4 at 2133/1867 MHz
– Two DDI channels, one LVDS (or 4 lanes eDP), support up to 3 independent displays
– Up to 6 PCIe x1 (by build option, up to Gen3 dependent on SKU)
– GbE, up to 3x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions
– Extreme Rugged operating temperature: -40°C to +85°C (build option)
– cTDP support on specific skus

COM Express Type 6 Basic module based on 8th Generation Intel® Core™ processor family

– 8th Generation Intel® Core™ processor with up to 6 Cores
– Intel® Xeon® processors for data center applications
– Support for USB 3.1 Gen2 with 10Gb/s
– Intel® Optane™ memory support
– ECC memory support
– Up to 32 GByte dual channel DDR4 memory

COM Express® Type 6 module based on AMD Ryzen Embedded V1000 Series SOC

– AMD’s Next Gen V1000 processor Series
– “Zen” core architecture with up to 4 cores
– Improved graphic performance with “Vega” GPU
– Up to 32GByte dual channel DDR4 3200MT/s memory
– TDP scalable down to 12W
– up to 4 x 4K DP / eDP