-Intel® Core™ i7/i5/i3 14nm processor (Comet Lake-S)
-2x DDR4-2933 Non-ECC/ECC SO-DIMMs, up to 2x 16GB
-USB 2.0/3.1 Gen 2, 4x SATAIII, 1x PCIe 3.0 x16, and 8x PCIe 3.0 x1
-LVDS, VGA, and 3x DisplayPort/HDMI

PCOM-B655VGL is the 10th Generation Intel® Comet Lake-S platform COM Express module. It is compatible with COMe 3.0 Type 6 carrier board. The desktop CPU on module offers customers higher computing power but lower cost comparing to mobile solutions. PCOM-B655VGL supports both ECC and Non-ECC DDR4 by different PCH SKUs (Q470E/W480E), which can be adapted to different applications. This module provides one PCIe x16, eight PCIe x1 (Option to one PCIe x4), four USB 3.1 Gen2, and four SATA III.


CM24201 is a COM Express Module designed by LinkedHope® based on Loongson®3A3000 processor and Loongson®7A1000 chipset. 3A3000 is a China local CPU, MIPS architecture, which has 4 cores, and each core runs at 1.2GHz frequency. CM24201 surface mounts up to 8GB ECC memory. CM24201 supports SATA storage interface. The whole Module has no moving parts and has good anti-shock/vibration performances.
CM24201 supports PCIe 2.0 bus which can be dynamically configured to x8/x4/x2/x1 according to customer needs. CM24201 supports 6xUSB2.0,1x HDA controller, 1×1000/100/10Mbps Ethernet interface. CM24201 also supports one HDMI and one LVDS or VGA output interface, the maximum display resolution is up to 1920×1080.
CM24201 supports a variety of mainstream operating systems such as Kirin, Dao, ReWorkss, Linux, and VxWorks. LinkedHope® provides the corresponding BSP or driver, which can greatly shorten the time to market and reduce development costs for customer system integrations
Target Applications:
Government, security, scientific research, medical, telecommunications, rail transportation


CM22202 is a Type 6 COM Express® module developed by LinkedHope® based on China local x86 architecture ZX® KX-6000 series Processors. This module pinout is compliant with PICMG COM.0 R3.0 specification. CM22202 contains all kinds of high-speed interfaces such as SATA III, USB 3.0 and PCIe 3.0. CM22202 provides dual-channel SO-DIMM, supporting DDR4-2666 MHz memory and the capacity up to 32GB.
CM22202 supports KX-6000 series 4 core processors which TDP from 25W to 55W. CM22202 provides high performance computing with balanced power consumption. CM22202 works well in a wide range temperature environment. It is ideal for the high-bandwidth and processing intensive requirements of industrial and edge computing applications.
Target applications:
>> communication device
>> Intelligence analysis
>> Data Processing
>> Edge Computing