Archives

June 27, 2016

AMC502

AMC502The AMC502 is an AMC FPGA Carrier with dual FMC (VITA 57) interface. The AMC502 is compliant to the AMC.1, AMC.2 and/or AMC.4 specification. The unit has an on-board, reconfigurable FPGA which interfaces directly to AMC FCLKA, TCLKA-D, FMC DP0-3, and all FMC LA/HA/HB pairs. Port 3 can be routed as LVDS.

The AMC502 has an on-board crystal-referenced clock source to provide at least 125 MHz as GTX reference inputs for PCIe, SRIO and GbE. The iMX6 CPU is a quad core ARM processor at 1 GHz for power-efficient distributed processing.

The AMC502 has dual FMC connectors per VITA-57 allowing the versatility of various FMC modules to be implemented.

March 31, 2016

AMC-D24A4-RFx

The AMC-D24A4-RF2/RF4 is an extremely high performance ARM, DSP and FPGA based processing card which includes two or four integrated, flexible, wideband RF transceiver channels.

The module is aimed at LTE, LTE Advanced and 5G systems that require MIMO technologies and enables complete RF to Layer 3 wireless basestation functionality to be implemented on a single AdvancedMC card.

The module’s main processor is the TCI6638 KeyStone II DSP/ARM SoC. It includes eight C66x+ DSP cores, as well as four ARM Cortex-A15 cores for higher layer processing. The module also has two TMS320C6678 octal C66x core DSPs. All processors are closely coupled via TI’s Hyperlink interface and the Ethernet infrastructure of the card with Serial RapidIO (SRIO) backplane connectivity providing inter-card connectivity. There is also a large Kintex-7 FPGA for additional co-processing and to manage the RF interfaces.

A version with no RF channels, the AMC-D24A4, is also available.

March 31, 2016

AMC-K2L-RF2

A low-cost, high performance AdvancedMC card based on TI’s TCI6630K2L SoC with 2×2 RF.

The AMC-K2L-RF2 is a low cost, high performance ARM and DSP based processing card which includes two integrated wideband RF transceiver channels, all in the compact Advanced Mezzanine Card (AMC) form factor.

It is designed to support wireless baseband processing and a 2×2 MIMO air interface in radio test systems, small cells, and UEs for standard or specialised LTE and LTE-Advanced systems up to and beyond Release 10.

The module’s main processor is the TCI6630K2L KeyStone II DSP/ARM SoC. It includes four C66x+ DSP cores, as well as two ARM CortexTM-A15 cores for higher layer processing. A TI AFE7500 analog front end provides flexible, high quality RF capabilities.Categories: