Member News

nVent Releases Next Generation nVent SCHROFF MicroTCA.4 Crate

  • NEW MTCA.4 Crate achieves 128 Gbits bandwidth per slot with PCIe Gen 5
  • Enhanced Cooling: Improved rear card cage cooling
  • Future Proof: New Cooling Unit Manager design based on controller with long life cycle
  • Backward Compatible: Mix and match legacy and new chassis and cooling units

nVent Electric plc (NYSE:NVT) (“nVent”), a global leader in electrical connection and protection solutions, announced the launch of its first MicroTCA.4 (MTCA.4) Crate in accordance with Revision 3.0 of the MTCA.0 base standard.

In September 2023 PICMG released Revision 3.0 of the MTCA.0 specification. This revision supports PCI Express Gen 4 and PCI Express Gen 5, as well as 100GBASE-KR4, to improve system performance by 4x. To accomplish these higher data rates, SMD and compression mount connectors have been evaluated by the Next-Gen MTCA working group, and the simulation results have been taken as a base to define the whole data transmission channel for MicroTCA. The transmission channel has been divided into logical parts to define the limits for boards and backplane to ensure all MTCA.0 Rev 3.0 MCHs, AMCs and crates work together in a PCI Express Gen 4/5 or 100 GbE environment.

As these high-end switches consume more power compared to their predecessors, the power budget for the MicroTCA Carrier Hub (MCH), where the switch resides, has been upgraded from 80 W to 110 W. To prevent overheating, the cooling unit’s power budget was also upgraded to 110 W. A software mechanism helps ensure the backward compatibility of old and new MCHs, Power Modules and Cooling Units.

In the Rear Transition Module (RTM), cooling the improved 110W power limit is achieved with powerful fans and superior cooling design.

The Cooling Unit firmware performs in accordance with revision 3.0 of the MicroTCA specification. When powering up it remains in the 80 W power rating. If the Power Module supports 110 W per slot, the cooling unit will adjust accordingly. If it only supports 80 W, or if the IPMI communication gets lost, the Power Module will stay in the 80W power envelope.

The Renesas H8S controller previously used on nVent SCHROFF MTCA.4 Crates has been end of life’d (EOL’d). For this reason, nVent has introduced a new Cooling Unit Manager design based on the STM32 controller from STMicroelectronics, which includes the additional features described above.

Providing the Highest Data Bandwidth

To achieve the higher data bandwidth, the maximum trace length defined in the MTCA.0 Rev. 3.0 specification needs to be matched. Therefore, MCH slots were moved from the outside to the middle of the card cage.

Upgraded Materials

The PCB material has been upgraded to a lower loss material with SMD connectors for superior performance. For optimized routing, the physical order of the AMC modules has been changed. In the past, nVent SCHROFF MTCA.4 Crates used the physical order starting from 1 (from left to right), which has now changed to: 7-8-9-10-11-12-MCH1-MCH2-6-5-4-3-2-1.

About nVent

nVent is a leading global provider of electrical connection and protection solutions. We believe our inventive electrical solutions enable safer systems and ensure a more secure world. We design, manufacture, market, install and service high-performance products and solutions that connect and protect some of the world’s most sensitive equipment, buildings and critical processes. We offer a comprehensive range of system protection and electrical connection solutions across industry-leading brands that are recognized globally for quality, reliability, and innovation. Our principal office is in London, and our management office in the United States is in Minneapolis. Our robust portfolio of leading electrical product brands dates back more than 100 years and includes nVent CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE. Learn more at www.nvent.com.

nVent, CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE are trademarks owned or licensed by nVent Services GmbH or its affiliates.

Press Contacts:
Christian Ganninger
Product Marketing Manager
nVent Electric plc
[email protected]

Christopher Smerillo
Product Manager
nVent Electric plc
[email protected]

April 8, 2024

Exciting Embedded World News (And More)

COM-HPCInteredgeMember NewsModBlox7Open Standards

More than 45 PICMG members will be exhibiting at Embedded World 2024. For the first time at the world’s largest trade fair dedicated to embedded technology, PICMG is the subject of two technical conference tracks. We’ll be hosting a 30th Anniversary Reception on Wednesday, April 10th, that’s open to all PICMG members as well as the press; we expect more than 150 attendees.

There is a lot of excitement around PICMG at Embedded World 2024, but those activities don’t even mention all the PICMG-related news released ahead of and during the show. From exciting industry partnerships to new branding, here are some of highlights from the PICMG news releases you’ll see around Embedded World 2024.

  • PICMG Celebrates Its 30th Anniversary—To celebrate this milestone, PICMG is rolling out all new branding, with new logos for all related specifications, in Hall 5, booth 5-342 at this year’s Embedded World in Nuremberg.
  • PICMG, OPAF Partnership to Advance Open Process Control Technology—The partnership fills a gap in edge controller hardware that exists in the O-PAS™ Standard—an open architectural framework for developing industrial process automation systems, currently being defined by OPAF initiatives.
  • PICMG ModBlox7 Specification To Be Showcased at 2024 Embedded World—In support of the ModBlox7 ratification, one of PICMG’s newest specifications, multiple members are collectively showcasing their newest products based on the spec at the 2024 Embedded World exhibition.
  • PICMG Announces Release of InterEdge Standard for Open, Modular Process Control Systems—The IEC 61499 and IEC 61131-compatible InterEdge specification promises to revolutionize the industry with an interoperable, multi-vendor alternative to proprietary Industrial PCs (IPCs), Programmable Logic Controllers (PLCs), and Distributed Control Systems (DCSs).
  • PICMG Bolsters New COM-HPC “Mini” Form Factor with Release of Carrier Design Guide Revision 2.2—This comprehensive document contains interface schematics, diagrams, design rules and requirements, and more for PCB layout engineers and hardware developers looking to create application-specific carrier boards that pair with COM-HPC modules.
  • TO COME! An Announcement from PICMG and the DMTF!

The Show(s) Must Go On

We’re only through the first quarter of 2024 and we’ve seen two new specification families introduced, multiple new specifications released, a call for participation on a new version of a familiar technology (AdvancedTCA), strengthened partnerships with multiple standards organizations, and more.

Later this month PICMG will be sponsoring the IEEE Real-Time Conference (RTC) in Vietnam, which serves as rallying point for a critical emerging deep tech economy (https://indico.cern.ch/event/940112/program). We will act as an umbrella for multiple members who develop and deliver products into this sector, and also participate in a Women in Engineering (WiE) event (https://indico.cern.ch/event/940112/page/33210-women-in-engineering-wie-event).

Later this year we will visit Embedded World North America in Austin, the MicroTCA Summit in Hamburg, and many more in-person and virtual events in between. Right now is one of the more exciting times in PICMG’s 30-year history, and I feel fortunate to be part of it.

(Editor’s note: If you’d like to attend the 30th Anniversary Reception and have yet to receive an invite or RSVP, contact [email protected], [email protected], or [email protected] to get on the list or schedule a meeting).

February 29, 2024

Decades of Contribution, Immeasurable Impact

COM ExpressCOM-HPCJess IsquithKontronPICMG

This year PICMG celebrates thirty years of developing open computing specifications. And despite three decades of open hardware specs that are used by thousands of companies and countless engineers worldwide, the organization is still largely an unknown—even in our own industry.

But from behind the scenes, PICMG is responsible for billions of dollars of business. It has reduced time to market in virtually every electronics-driven industry. It has empowered companies to innovate by adopting off-the-shelf technologies, giving them space to focus on their core competencies. It has built markets based on coopetition, where companies collaboratively develop open, interoperable specifications then go toe-to-toe once they are ratified.

Even less recognized are the individuals who donate hundreds if not thousands of hours to the creation of PICMG specifications. These engineers are rarely acknowledged for their contributions. They are truly unsung heroes, and PICMG specifications wouldn’t exist without them.

One of these unsung heroes is Stefan Milnor, who recently retired from his role as VP of Engineering at Kontron. In parallel, he stepped down as the long-time editor of COM Express and COM-HPC specifications. 

Stefan has been involved in PICMG since the beginnings of COM Express, which is undeniably the most successful computer-on-module in a billion-dollar COMs market. As editor, Stefan incorporated input from numerous technical subcommittees over the years and implemented it into specifications that have been adopted by thousands of organizations building embedded systems. It’s a difficult job that requires a rare mix of technical acumen and attention to detail, and his skill and efficiency will be missed by us all—including some who never knew he was the hand behind their downloaded spec.

Stefan has always been a very private individual. In fact, by the time we could reach out to him for comment he had already left. In some ways, it’s a fitting conclusion for someone who performed yeoman’s work for decades without reward. And although he probably isn’t reading this, his contributions to PICMG and the embedded computing industry deserve to be acknowledged.

Thank you, Stefan, for helping make PICMG what it is today: 30 years strong and counting.

— Jessica Isquith, President, PICMG

Admin Note: Contact Doug Sandy, PICMG CTO, at [email protected] to learn how you can get involved in PICMG’s technical working groups. Contact me, [email protected] if you are interested in joining PICMG or have any questions about our organization.