Industry News

• 30th anniversary highlighted by two new specification families and industry partnerships
• New PICMG branding on display at embedded world Hall 5, Booth 342
• Reception for PICMG members to be held on Wednesday, April 10th at Nuremberg Messe

April 8th, Nuremberg, Germany. For 30 years, PICMG has been shaping the embedded computing industry with standards. However, the organization is by no means resting on its laurels. Quite the opposite: with the ratification of two completely new standards just this year, the consortium and its members are looking forward to the next 30 years. To celebrate this milestone, PICMG is rolling out all new branding, with new logos for all related specifications, in Hall 5, booth 5-342 at this year’s embedded world in Nuremberg.

Founded in 1994, PICMG is a nonprofit consortium of companies and organizations that collaboratively develop open standards for high performance embedded computing applications used by the telecommunications, military, and industrial market sectors.

There are over 140 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, very high speed signaling design and analysis, networking expertise, backplane and packaging design, power management, High Availability software, and comprehensive system management. Over 40 members will be showcasing their products based on PICMG specifications at the 2024 Embedded World.

Some of the standards families developed under PICMG include COM-HPC, COM Express®, MicroTCA®, CompactPCI® Serial, AdvancedMC®, CompactPCI®, AdvancedTCA®, as well as the newly ratified ModBlox7 and InterEdge.

In its 30 years of operation, PICMG has published over 60 specifications developed by participants from hundreds of companies. Work across a wide range of markets, applications, and technologies continues as the boundaries of datacom, telecom, mil/aero, industrial, man machine interface applications, and deeply embedded computing blur.

Thousands of products ranging from components, subsystems, and complete application ready systems are commercially available and represent over $5B USD in yearly global revenue.

To Learn More:
Visit the “Value of Open Standards Page” here. Discover more about the open standards environment and learn how your company can participate and profit from belonging to PICMG here. Or, attend the 2024 Embedded World Exhibition & Conference to meet with PICMG representatives in person.

• PICMG website: www.picmg.org
• Embedded World 2024 website: www.embedded-world.de

About PICMG
Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high-performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 150 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, InterEdge, ModBlox7, SHB Express, MicroSAM, and HPM (Hardware Platform Management). For more information, visit https://www.picmg.org.

• CPU, Power Supply, and I/O units can be configured as redundant or non-redundant systems in transportation, automation, avionics, defense, and other markets
• 1.4” horizontal pitch (7 HP) per unit supports mounting on walls, DIN rails or side-by-side in a 19” sub-rack
• Modular, scalable architecture removes backplane for configurable, cost-effective low-, medium-, and high-volume production runs

WAKEFIELD, MA. PICMG, a leading consortium for the development of open embedded computing specifications, has ratified the ModBlox7 base specification. The first-of-its-kind specification addresses industry’s need for modular and interoperable embedded box PCs by defining a flexible mechanical architecture and “units” that fit a 1.4-inch horizontal pitch (7 HP) form factor.

The ModBlox7 architecture removes expensive components like backplanes and shelf controllers to enable the creation of price-competitive systems even at low volumes. Up to 12 of the 7 HP units can be interconnected and mounted on walls, DIN rails, or inserted in a 19” sub-rack.

“With ModBlox7, we combine the advantages of modular standards like CompactPCI and CompactPCI Serial with the demands we see from box PC customers like cost sensitivity, small form factor, and low weight,” explains Mathias Beer, CEO of Ci4Rail GmbH and member of the PICMG ModBlox7 working group. “By combining all of this in a PICMG specification, ModBlox7 addresses the design requirements of our clients and avoids vendor lock in.”

The Building Block Architecture of ModBlox7

A typical ModBlox7 system consists of Power Units, Processing Units, and PCIe or USB 2.0/3.0 Input and Output Units (IOUs), each of which measures 1.4” or 7 HP wide. Units can also be extended in 7HP increments to 14 HP, 21 HP, and so on and remain compatible with the specification.

Power Unit blocks convert external supply voltage into a 12V internal voltage and connect to Processing Units via terminal wire-to-board or board-to-board connectors. Processing Units support an overall thermal design power (TDP) of up to 150W and interface with IOUs over high-speed board-to-board connectors.

While a minimum ModBlox7 system consists of just one Processing Unit and one Power Unit, they can support as many as four PCI Express-based or eight USB-based IOUs. For high-availability or safety applications, ModBlox7 systems can also be configured with redundant Processing Units or Power Units. The maximum number of slots supported in any ModBlox7 is 12.

“The ModBlox7 standard defines a direct board-to-board interconnect in a box format to realize cost-effective system solutions,” says Bernd Kleeberg, CEO and Head of Sales at EKF Elektronik GmbH and chair of the PICMG ModBlox7 working group. “Thanks to native support for redundancy, ModBlox7 is also recommended for high-availability solutions.”

Getting Started with ModBlox7

ModBlox7 is designed for edge computing, data acquisition, communication, and control use cases in transportation, automation, avionics, defense, medical, agriculture, and other demanding markets. A multi-vendor supplier ecosystem helps control cost and ensures product availability over the long lifecycles of deployments in these domains.

Members of the PICMG ModBlox7 subcommittee include Ci4Rail GmbH, EKF Elektronik GmbH, ELTEC Elektronik AG, Elma Electronic, Embeck Co., Ltd., ept GmbH, HEITEC AG, Hirose Electric Europe B.V., nVent/Schroff GmbH, Phoenix Contact GmbH & Co. KG, Samtec, Inc., Sealevel Systems, Inc., UBER Co. Ltd., FASTWEL Group Co. Ltd, and Tews Technologies GmbH.

Products based on the ModBlox7 base specification are available now. The specification is also available for purchase and download at www.picmg.org/product/modblox7.

For more information on ModBlox7, visit:

• ModBlox7 Industrial Box PC Standard: Overview & How to Get Involved: www.picmg.org/modblox7
• PICMG ModBlox7—An Open, Flexible Standard for the Growing Industrial Box PC Market: https://embeddedcomputing.com/application/industrial/industrial-iot/picmg-modblox7-an-open-flexible-standard-for-the-growing-industrial-box-pc-market

About PICMG
Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 140 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, InterEdge, ModBlox7, SHB Express, MicroSAM, and HPM (Hardware Platform Management). For more information, visit www.picmg.org.

Latest MicroTCA revision adds high-bandwidth interfaces and increased TDP to prepare the specification for demanding next-generation edge and server workloads

WAKEFIELD, MA. PICMG, a leading consortium for the development of open embedded computing specifications, has ratified Revision 3.0 of the MicroTCA.0 (µTCA.0) specification. This new release addresses urgent bandwidth requirements by defining 100 GbE and PCIe Gen 5 fabrics that improve system performance by 4x while also expanding platform thermal design power (TDP), enabling the use of higher performance processors. Users can now select from a range of specification-compliant building blocks and solutions that allow for more power per slot for higher transfer rates within µTCA chassis and to external systems and server clusters. It also lays the foundation for building next-generation MicroTCA proofs of concept.

Revision 3 of MTCA.0 addresses the current and future demands of applications such as machine vision, AI, defense, research, instrumentation, wireless communication, and emerging applications like quantum computing. “Revision 3 of MTCA.0 addresses urgent requirements and thus enables companies to now provide specification-compliant solutions rather than proprietary or custom approaches,” says Heiko Korte of NAT Europe and lead of PICMG’s MicroTCA Technical Working Group. “The fact that so many MicroTCA ecosystem suppliers have joined the working group shows the importance of the changes and also underlines the strong interest to make these part of an open specification.

“The broad spectrum of participants also ensured that every single agenda item got reviewed from different angles and properly discussed,” he adds.

MicroTCA.0 Revision 3.0-compliant solutions will be available shortly, including chassis, MicroTCA Carrier Hub (MCH), Advanced Mezzanine Card (AMC), Rear Transition Module (RTM), and power modules (PM) products from VadaTech, NAT, AIES Sp z o.o., nVent SCHROFF, and others. The commitment of existing vendors to continuing the development of µTCA products is joined by increased interest from players in emerging fields like quantum computing, projecting a healthy lifecycle for the open computing specification for years to come.

“VadaTech is proud to have been part of the development and ratification of revision 3 of the uTCA specification,” says Alex Malcom, Managing Director of VadaTech Ltd. “Its release secures the continued adoption of the standard by commercial, scientific and defense organizations around the world.”

The MicroTCA.0 Revision 3.0 specification can be accessed at www.picmg.org/product/micro-telecommunications-computing-architecture-base-specification. For more information on the MicroTCA family, visit https://www.picmg.org/openstandards/microtca.

About PICMG

Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are over 130 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, SHB Express, MicroSAM, and HPM (Hardware Platform Management). https://www.picmg.org.