Next-generation AI computing for the edge 

Deggendorf, Germany, 20 December 2023 * * * congatec – a leading vendor of embedded and edge computing technology – is introducing its latest range of COM Express Compact modules based on the Intel^® Core™ Ultra processors. Providing a unique combination of heterogeneous compute engines, including CPU, GPU and NPU, the new modules are an ideal fit to run demanding AI workloads at the edge.

Next to the powerful P-cores and efficient E-cores for general computing and the high-performance Intel^® Arc™ GPU for graphics-intensive tasks, the integrated Neural Processing Unit (NPU) called Intel^® AI Boost contributes advanced neural processing capabilities to the overall computational architecture. The integrated NPU enables highly efficient integration of advanced artificial intelligence workloads at lower system complexity and costs than discrete accelerators. This makes the new Intel Core Ultra processor-based Computer-on-Modules especially beneficial for combining high-performance real-time computing with powerful AI capabilities in surgery robots and medical imaging and diagnostic systems, where automatically generated critical findings can support medical personnel. Other application targets are situational awareness in industrial applications such as inspection systems, stationary robotic arms, autonomous mobile robots (AMRs), and autonomous guided vehicles (AGVs), to name just a few.

“The new conga-TC700 COM Express Compact Computer-on-Modules provide application-ready AI capabilities in a plug-and-play form factor. Its ecosystem of customer solution-focused products and services significantly improves the time-to-market for implementing the latest state-of-the-art x86 with powerful AI capabilities as required in industrial process control, microgrid controller, medical ultrasound and x-ray, automated check-out terminals, powerful AMRs, and many more,” says Tim Henrichs, VP Global Marketing & Business Development at congatec. “OEMs can simply upgrade existing applications by exchanging the module and instantly gain access to cutting-edge AI technologies. It has never been easier to integrate artificial intelligence in x86-based systems.”

The feature set at a glance

The new conga-TC700 COM Express Compact Computer-on-Modules with Intel Core Ultra processors (code named Meteor Lake) are among the most power-efficient x86 client SoCs available on the market. Up to 6 P-Cores, up to 8 E-Cores, and 2 Low Power E-Cores support up to 22 threads, making it possible to consolidate distributed devices onto a single platform for the lowest total cost of ownership. The SoC-integrated Intel Arc GPU with up to 8 Xe Cores and up to 128 EUs can handle stunning graphics up to 2x 8K resolution and ultra-fast GPGPU-based vision data (pre)processing. The integrated NPU Intel AI Boost executes machine learning algorithms and AI inferences particularly efficient. Up to 96 GB DDR SO-DIMM with in-band ECC at 5600 MT/s contributes to power-efficient high data throughput and low latency.

The modules are supported by congatec’s OEM solution-focused high-performance ecosystem, including highly efficient active and passive cooling solutions and ready-to-use evaluation carrier boards. Customers can order the modules with pre-evaluated real-time hypervisor technology from Real-Time Systems for virtual machine deployments and workload consolidation in edge computing scenarios. Service offerings include shock and vibration tests for custom system designs, temperature screening, and high-speed signal compliance testing, along with design-in services and all required training sessions to simplify the use of congatec’s embedded computer technologies to round off the ecosystem.

The new conga-TC700 COM Express Compact Type 6 modules support the embedded temperature range from 0 °C to 60 °C and are available in the following standard configurations:

All features of the new Intel Core Ultra processor-based conga-TC700 COM Express Compact modules can be found here: https://www.congatec.com/en/products/com-express-type-6/conga-tc700/

For more information on the innovative Intel Core Ultra processor platform please visit https://www.congatec.com/en/technologies/intel-meteor-lake-h-based-computer-on-modules/

You can experience these and other innovations at embedded world from 9-11 April 2024: https://www.congatec.com/en/congatec/events/congatec-at-embedded-world-2024/

Visit congatec in Hall 3 at Stand 241

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About congatec 

congatec is a rapidly growing technology company focusing on embedded and edge computing products and services. The high-performance computer modules are used in a wide range of applications and devices in industrial automation, medical technology, robotics, telecommunications and many other verticals. Backed by controlling shareholder DBAG Fund VIII, a German midmarket fund focusing on growing industrial businesses, congatec has the financing and M&A experience to take advantage of these expanding market opportunities. congatec is the global market leader in the computer-on-modules segment with an excellent customer base from start-ups to international blue chip companies. More information is available on our website at www.congatec.com or via LinkedIn, X (Twitter) and YouTube.

WAKEFIELD, Mass., October 9, 2023. PICMG, a leading consortium for developing open embedded computing specifications, has announced the release of the COM-HPC 1.2 “Mini” specification. Measuring just 95 mm x 70 mm, COM-HPC Mini is nearly half the size of the next-smallest COM-HPC form factor and provides a cost-effective, lower power module for autonomous mobile robots, drones, mobile 5G test and measurement equipment, and other far edge applications.

A single, rugged 400-pin connector allows COM-HPC Mini to support communications interfaces such as:

• 16x PCIe lanes (PCIe 4.0 or PCIe 5.0)
• 2x 10 Gbps NBASE-T Ethernet ports
• 8x SuperSpeed lanes (for USB4/ThunderBolt, USB 3.2, or DDI)
• 8x USB 2.0
• 2x SATA ports (shared with PCIe lanes)
• 1x eDP
• 2x DDI

The 1.2 specification defines a separate FFC connector for MIPI CSI, while its 400 pins also support signals such as Boot SPI and eSPI, UART, CAN, Audio, FUSA, and power management signals. A signal voltage reduction from 3.3V to 1.8V on most pins is in line with reduced I/O voltage on the latest low-power CPUs. The input power is limited to a maximum of 107W at a wide input voltage of 8V to 20V, leaving plenty of headroom for performance processors.

“The COM-HPC size A started at 95 mm x 120 mm, but the market loves the Mini size as well as the performance you get with COM-HPC,” says Christian Eder, Director of Product Marketing at congatec and Chairman of the COM-HPC Working Group at PICMG. “The whole trend of making things smaller and more power-saving was a reaction to market trends, and it will continue.”

Mini’s smaller footprint also provides mechanical advantages, such as a 15 mm stack height from the top of a carrier board to the top of a heat spreader stacked on a COM-HPC Mini module. This 5 mm reduction compared to other COM-HPC variants means COM-HPC Mini modules must use soldered memory, which makes them inherently rugged through resistance to shock and vibration and provides direct thermal coupling to heat spreaders.

“The new revision of the specification allows COM-HPC to address additional high-performance applications that require a smaller footprint,” says Doug Sandy, CTO of PICMG. “COM-HPC 1.2 is a great solution that completes the spectrum of solutions of COM Express through COM-HPC Server Modules.”

“The COM-HPC Mini specification leverages the high-speed capabilities and SI performance of existing COM-HPC interconnect solutions,” says Matthew Burns, Global Director of Technical Marketing at Samtec. “Dropping one 400-pin connector enables small form-factors without sacrificing the data throughput demanded at the Far Edge.”

PICMG members ADLINK, congatec, Samtec, SECO, and others have either already released or plan to release COM-HPC 1.2 product in the near future.

The COM-HPC 1.2 specification can be downloaded today for $750 from the PICMG website at www.picmg.org/product/com-hpc-module-base-specification-revision-1-2. A COM-HPC 1.2 Carrier Design Guide is scheduled for release in early 2024.

For more information, visit www.picmg.org/openstandards/com-hpc.

About PICMG

Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are over 130 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, SHB Express, MicroSAM, and HPM (Hardware Platform Management). www.picmg.org.

The Members Only interview series highlights leaders from within PICMG and throughout the open standards development community. We recognize their contributions and seek insight into their thought processes and strategies that are driving open technology-powered industries forward.

This issue we introduce Doug Sandy, the CTO of PICMG. Over the past few months Doug has been busy handling the review and approval process of specifications such as MicroTCA.0 Revision 3, COM-HPC 1.1, COM-HPC 1.2, and ModBlox7.

PICMG: Who is Doug Sandy and what does he do?

DOUG: Who is Doug Sandy? What does he do? I am the Chief Technology Officer of PICMG. A little bit of background about me, I started in the embedded computing industry back in 1993 at a company called Pro-log.

Pro-log was based in Monterey, California, and we were one of the original founding members of PICMG. I don’t think I was in the very first meeting of PICMG, but I was there at the second meeting and my career sort of grew up with PICMG.

In 2017, I retired from my Chief Technology Officer position in industry to teach full time at Arizona State University, which is the largest university in the United States. I teach software engineering there and it also provides me a great opportunity to bring some of the things that are going on in PICMG and embedded computing into the classroom. It’s a nice merger of the two worlds of academia and industry.

I really enjoy working for PICMG. I enjoy the collaboration and the general atmosphere of the standards organization. We’re a no-nonsense organization. We get work done and we focus on working together. I’ve worked with other standards organizations or specification groups, and that’s not always the case. So, it’s just a joy to be in PICMG leadership.

PICMG: Speaking of work and getting work done, tons of different specifications are in the process of being ratified. What’s been on your desk recently?

DOUG: Oh, my goodness. Over the last year or two there have been more specifications going through PICMG than I can remember in all PICMG’s history. That’s a testament to PICMG’s relevance in the market.

One of the themes I’ve seen with the specifications going through is a return to PICMG roots – we started out as the PCI Industrial Computer Manufacturers Group. The specs we have in development right now have much more of a flavor of the traditional embedded markets. We’ve got things going into space, transportation, energy, robotic control, factory automation, and I’ve also heard rumblings of things going into telecommunications.

On a specification level, COM Express is a workhorse and it just keeps going. That’s the number-one module form factor out there by any measure you choose to look at it. There’s also been a huge interest in COM-HPC. PICMG is extending the computer-on-module concept from the laptop-caliber performance that you get with a COM Express module all the way up to high-end server performance with COM-HPC. One of the application spaces that’s been talked about is telecommunications for 5G applications, where you put computing at the edge or even merge the computing and the control node capabilities. But when you have a high-performance compute engine that’s on a module, you can do all sorts of other things with it.

In the high energy physics community, we have MicroTCA and AdvancedTCA. We have an initiative that’s aimed at oil and gas, which is exciting because it’s built for that space but can also find its way into other harsh environment automation spaces right near where the sensors and real-world interfaces are.

Another thing that’s in the works is ModBlox7, which is a modular computing concept that also takes us toward the sensors, toward the very edge of the computing network.

So there’s lots going on at PICMG. I can’t cover everything in this one interview. It’s really an exciting time. It’s fun to see how PICMG has evolved and shifted over the years.

PICMG: What do you think are the core values that keep engineers and organizations coming back to open standards like PICMG?

DOUG: It depends on where in the supply chain you sit. If you are an engineering manager, the value of open specifications is probably different than if you are an adopter of technology or an engineer that’s designing technology.

But if you’re a company that’s designing technology, one of the things open specifications and open standards do is provide a known interface you can design to. If you want to purchase, for instance, a module that plugs into your carrier card, you want to have an ecosystem of hardware out there that you can plug into your carrier and work. Without an open specification or open standard, what you have in the marketplace is just a variety of proprietary solutions; you can’t really focus on what you need to do without making it also tied to this other proprietary solution.

Open standards give you an opportunity to focus on what you’re good at. If you’re good at carrier boards, then you can focus on the carrier board and the logic and I/O on that and know there’s a compliant module that can plug in. This provides you freedom to focus on what you want, but also confidence in an ecosystem. If you’re on the other side of things and designing the modules, it provides a stable market as well because you know there are people creating carrier boards that need your module.

From those two perspectives, it’s helpful in building ecosystems. Other things open specifications are good for are problems that just can’t be solved by individual companies. I’ll give you an example of 100 Gigabit Ethernet (GbE).

100 GbE was something that we wanted to put on a backplane long ago. But if we had individual member companies working on how to solve that problem of 100 GbE the issue becomes we’ve got connector vendors designing connectors for what they think 100 GbE is, we’ve got backplane designers or cable designers designing for what they think it is, and we have board manufacturers designing to what they think. What you have is a bunch of chaos and the burden of integrating a system without an open specification or standard that governs all that falls on the integrator. The integrator needs to qualify every single piece of their solution and it can become very, very difficult.

What open specifications and open standards organizations do is provide a safe harbor for competitors to collaborate with one another to solve these industry problems. PICMG has been successfully doing that since its inception. I can’t say enough good things about the PICMG member companies, their professionalism, and their technical competency in solving some of the hardest technology problems in the industry. And I know that we’re going to continue that in the future.

PICMG: What are some of the things that you’re available to the community for?

DOUG: My primary responsibility as Chief Technology Officer of PICMG is to manage and respond to requests about the organization’s policies and procedures. That includes facilitating the entire specification standardization process, from statement of work through ratification.

I’m always interested in new concepts for specifications and assisting with making them a reality. If you have an idea for a specification that you want to see turned into reality, please reach out to me and I will try to help you along that process. That is part of my role as well.

Some of the other things that I’m really interested in on a technology level is in the space of Industrial IoT. How can we promote cyber-physical systems and digital twinning? PICMG does have some work going on in that area, laying the foundation in our IoT work. So, if you want to talk to me about that, that’s an exciting topic. I’d even be open to facilitating some research in that area with student workers. I think that’s going to be an exciting technology as it comes to reality in the future.

PICMG: How can the membership get in touch with you?

DOUG: [email protected].