• Meet ExxonMobil, Schneider Electric, Phoenix Contact, Intel, Samtec and others at embedded world North America on October 8^th to learn how to participate.
• InterEdge Technical Working Group (TWG) to define the specification’s compute module bus, multi-channel I/O modules, and other system architecture elements.
• InterEdge reference architecture will accelerate the development of open and interoperable ecosystem and creation of conformant hardware in 2024.

October 8, 2024 — WAKEFIELD, MA. PICMG, a leading consortium for developing open embedded computing specifications, has announced formation of the InterEdge 1.1 Technical Working Group (TWG). Industry professionals looking to shape future technologies throughout the process industries, including refining, chemical, oil gas, pharmaceuticals, metals and mining, pulp and paper, as well as food and beverage, are encouraged to join the standardization effort by contacting [email protected] or visiting members of the TWG at embedded world North America, October 8-10^th in Austin, TX.

InterEdge is intended for broad process industry use as an alternative to industrial PCs (IPC), programmable logic controllers (PLC), distributed control systems (DCS) and their associated I/O modules. With its modular architecture, InterEdge can consolidate the functions of all of these systems into a single platform.

InterEdge is an open electromechanical and software interface specification designed to support the interchangeability of industrial-grade compute modules, input/output (I/O) modules, and network switches for industrial automation and process control industries. Version 1.1 of the InterEdge standardization effort seeks to build on the mechanical and interface definitions completed previously by defining standard compute modules, multi-channel I/O modules, an InterEdge reference architecture, and more.

”The InterEdge 1.1 TWG is running full speed ahead bringing the benefits of interchangeability to the automation industry,” said Matthew Burns, InterEdge 1.1 Technical Working Group chair. “The collaboration and innovation of industry leaders within the InterEdge community will drive adoption in future system builds for generations to come.”

The primary work performed by the InterEdge 1.1 TWG will include completing definitions of a compute module expansion bus, multi-channel I/O, additional I/O, thermal design, anti-tamper, out-of-band management, additional diagnostics and termination assemblies.

The working group will also define an InterEdge reference architecture that connects multiple compute and I/O modules over an internal Ethernet I/O bus. In compliance with the Open Process Automation Forum’s (OPAF’s) Open Process Automation Standard (OPAS), the reference architecture will support an IEC 61499 runtime on top of a Linux OS. IEEE 802.3 and 10Base-T1S MAC/PHYs are included to support external networking over industrial Ethernet, MQTT, DDS and other protocols.

Reference compute modules are being supplied by ASRock Industrial while the PCB and connectors are being developed by Samtec. I/O module vendors are currently being identified.

“The InterEdge specification enables interoperability and interchangeability to the process automation markets, which previously required companies to choose between proprietary solutions. The work of OPAF to address the broader needs of truly rugged edge applications will allow these markets to deploy greater IoT capabilities, including preventative maintenance, greater reporting and better process efficiencies. PICMG strives to accelerate the adoption of open standards and develop specifications as a consortium or in conjunction with like organizations,” said Jessica Isquith, president, PICMG.

Members of the InterEdge 1.1 TWG will attend the Embedded World North America conference and exhibition in Austin, TX from October 8-10. Companies and organizations interested in learning more about the new PICMG specification, the OPAS standard of which it is a part, or the ways open automation technology is enabling next-generation initiatives like software-defined manufacturing (SDM) can visit the following landing pages:

• picmg.org/openstandards/interedge
• picmg.org/product/interedge

About PICMG
Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are over 130 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include InterEdge, COM-HPC, COM Express, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, SHB Express, MicroSAM, HPM (Hardware Platform Management), and ModBlox7.

For more information, visit www.picmg.org.

• PICMG IoT.1 interoperable data modeling capabilities have been included in the latest release of the DMTF Redfish specification.
• Ongoing work will extend the Redfish job model to support factory orchestration and management via cloud-based platforms like AWS.
• A reference Redfish server based on PICMG IoT.x is being developed on GitHub to demonstrate the potential of plug-and-play Industry 4.0 use cases.

WAKEFIELD, MA. PICMG, the consortium driving open standards for modular, scalable computing, and DMTF, have announced that an IP submission containing the PICMG IoT.x firmware specification was accepted and included in the most recent Work in Progress phase of the Redfish^® standard. The extensions to Redfish will streamline the creation of plug-and-play Industry 4.0 systems by connecting interoperable data models on IoT.x-enabled endpoints to software-defined converged infrastructure via the Redfish API.

Redfish is an IT industry standard commonly used for data collection and device management in equipment such as data center fans and coolant pumps. Since 2018, PICMG and DMTF have worked collaboratively to extend the capabilities of Redfish to automation and factory equipment, enabling remote management and control of robotic motion platforms, contextualized sensing systems, and other advanced control endpoints.

The result of those efforts is PICMG IoT.1 and IoT.2, which add extensions to DMTF’s Redfish standard, now included in the latest publication.

“DMTF specifies protocols, data formats, and models for interoperable management on control plane infrastructure including edge systems,” said Jeff Hilland, DMTF president. “Since a lot of what we do is applicable to edge hardware, it makes sense to work with PICMG as part of our alliance partner program.”

Extending Data and Control Capabilities

The PICMG IoT.1 firmware specification defines a standard data model for sensor makers and systems integrators, while PICMG IoT.2 addresses the data model and network architecture requirements for the integration of larger sensor/effector networks.

Together, the two specifications accelerate the development and deployment of smart sensors in Industry 4.0 applications. Redfish extensions integrate these capabilities in a larger system of systems context while remaining fully compatible with the PICMG IoT.x specifications.

PICMG is also working on extending the Redfish job model to support cloud-based scheduling and orchestration of factory equipment. This will allow industrial operators to leverage powerful cloud platforms like AWS to manage jobs all the way to control endpoints on a factory floor.

“Imagine a modular factory where every component is interconnected and fully plug-and-play not just at the sensor and effector level, but across the entire assembly line,” said Doug Sandy, CTO of PICMG. “A factory where every piece of equipment has its own associated Redfish service, workloads, and processing could happen wherever they need to, while operators could manage and monitor everything through a top-down hierarchy of building, floor, and line controllers.”

“That’s what PICMG and DMTF ultimately want to support. And with our current work on Redfish, we’ve taken a big step in the right direction,” he added.

Building the Factory of the Future

PICMG’s IP submission recently entered DMTF’s Work in Progress phase and is slated for a projected full release in 2025. During the Work in Progress phase, the development community will have the opportunity to review and comment on the new content of the specification so changes can be incorporated prior to the next Redfish release.

PICMG and DMTF also currently have a team working on an example implementation of the interoperable data environment, expressed in the form of an open-source server. Accessible on the PICMG GitHub repository, new functionality is being added to the server each month with the goal of it becoming fully functional in time for the next Redfish specification release.

The PICMG extension is publicly available on the DMTF website at: www.dmtf.org/sites/default/files/PICMG_DMTF_Work_Register_v1.1.pdf.

Learn More

• PICMG Industrial IoT Overview: https://www.picmg.org/industrial-iot-overview
• PICMG IoT Firmware Specification: picmg.org/product/iiot_firmware
• DMTF Website: dmtf.org
• PICMG Redfish Submission: dmtf.org/sites/default/files/PICMG_DMTF_Work_Register_v1.1.pdf
• PICMG Redfish Server on GitHub: https://github.com/PICMG/redfish_server_maker
• E-mail Contact: [email protected]

About DMTF

DMTF, an industry standards organization, creates open manageability specifications spanning diverse emerging and traditional IT infrastructures including cloud, virtualization, network, servers, and storage. Member companies and alliance partners worldwide collaborate on standards including Redfish, SPDM, SMBIOS, MCTP, PLDM, and more to improve the interoperable management of information technologies. Nationally and internationally recognized by ANSI and ISO, DMTF standards enable a more integrated and cost-effective approach to management through interoperable solutions. Simultaneous development of Open Source and Open Standards is made possible by DMTF, which has the support, tools, and infrastructure for efficient development and collaboration. For a complete list of our standards and initiatives, visit the Standards and Technologies section of the DMTF website.

DMTF is led by a diverse board of directors from Broadcom Inc.; Cisco; Dell Technologies; Hewlett Packard Enterprise; Intel Corporation; Lenovo; Positivo Tecnologia S.A.; and Verizon.

About PICMG

Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high-performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 150 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, InterEdge, ModBlox7, SHB Express, IoT.x, and HPM (Hardware Platform Management).

For more information, visit https://www.picmg.org.

Highlights:

• The multi-part virtual event will show attendees how to take advantage of PICMG’s next-generation computer on module specification family for intelligent edge use cases.
• Sessions will address how the Mini form factor enhances performance in mobile-friendly deployments, new features like the updated COM-HPC connector, and a new Carrier Design Guide.
• Attend for free on June 4^th at 14:00 UTC at https://t.ly/COM-HPCMiniAcademy.

MAY 29, 2024 — WAKEFIELD, MA. PICMG, the consortium driving open standards for modular, scalable computing, will be hosting a COM-HPC Mini Academy on Tuesday, June 4 at 14:00 UTC. This multi-part virtual event will span four sessions and introduce participants to the new COM-HPC Mini form factor’s features, including details of the Mini’s updated Carrier Design Guide, as well as examine use cases, design questions, and deployment challenges.

“Between converged network rollouts and advances in artificial intelligence, the hardware requirements for edge computing have changed,” said Doug Sandy, CTO of PICMG. “Modern edge workloads need a combination of high-end computing, power consumption management, and low-latency data transmission. The COM-HPC Mini addresses these requirements, and our Mini Academy will teach developers everything they need to know about how the specification brings the intelligent edge to life.”

The event will be divided into four sessions covering the following topics:

• How COM-HPC Mini improves performance in mobile-friendly deployments.
• The importance of support for CPU, GPU, FPGA and heterogenous processor architectures in diverse edge applications.
• Details on new features in COM-HPC and how they enable greater bandwidth, lower latency, more rugged designs, and interoperable high-speed chip-to-memory interconnects.
• How the updated Carrier Design Guide streamlines development and deployment of cost-optimized, low-to-mid volume production runs.

More details on each session can be found below:

Session 1: June 4^th at 14:00 UTC—What’s New in COM-HPC?

The first Mini Academy session, co-hosted by representatives from congatec, Samtec, and the University of Bielefeld, provides an update on COM-HPC and how it can help organizations transform their edge infrastructure. Alongside updates to the COM-HPC specification family, the session will explore potential PCIe Gen 6 support, CXL 3.1 compatibility, and Functional Safety (FuSa) capability.

Session 2: June 4^th at 14:30 UTC—Introducing COM-HPC Mini

Co-presented by Richard Pinnow of ADLink and Christian Engels of Avnet Embedded, this session will detail how COM-HPC Mini provides system architects with greater speed and performance in a smaller form factor. Participants can expect a review of the new specification’s electromechanical features, followed by demonstrations of how they can leverage those features for far edge mobile and battery powered use cases, such as AMRs, HMIs, drones, and robotic controllers.

Session 3: June 4^th at 15:00 UTC—Exploring the COM-HPC Mini Design Guide

Presented by Kontron’s Peter Hunold, this session introduces the updated Carrier Design Guide developed specifically for the COM-HPC Mini specification. Participants will be given an overview of how the COM-HPC Design Guide has changed from previous versions. The session will conclude by demonstrating how to design in advanced signals, like multiplexed USB 4.0 and how to quickly and efficiently produce Gerber files that define lasting COM-based systems.

Session 4: June 4^th at 15:30 UTC—The COM-HPC Mini Academy: A Multi-Vendor Outlook Panel

Co-hosted by several of the suppliers responsible for developing the COM-HPC Mini specification, this discussion panel will field questions from attendees about designing and deploying the new standard. Participants will also learn about the differences between COM Express and COM-HPC, along with best practices for designing the COM-HPC Mini into real-world applications. The session will then conclude with insight into PICMG’s technology roadmaps.

Going Beyond the Intelligent Edge

“First ratified in 2021, COM-HPC was designed to address the challenges and fulfill the requirements of embedded system architects,” explained Sandy. “COM-HPC Mini continues this trend, introducing a new form factor and features like expanded connectivity support, efficient thermal management, and soldered memory.”

“Open, interoperable, and available from multiple suppliers, COM-HPC Mini provides a path forward for edge computing that will remain relevant for decades,” he added, inviting anyone interested in learning more about COM-HPC Mini and other specifications to visit PICMG’s website.

Recordings of the COM-HPC Mini Academy sessions will be available on-demand for those unable to attend the live event.

Learn More

• Event Registration: https://t.ly/COM-HPCMiniAcademy
• COM-HPC Overview: https://www.picmg.org/openstandards/com-hpc/
• Carrier Design Guide: https://www.picmg.org/wp-content/uploads/PICMG_COM-HPC_CDG_R2_1.pdf
• COM-HPC Mini: https://www.picmg.org/openstandards/com-hpc

About PICMG

Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 150 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, COM-HPC Mini, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, InterEdge, ModBlox7, SHB Express, MicroSAM, and HPM (Hardware Platform Management). For more information, visit https://www.picmg.org.