Samtec COM-HPC® Interconnects from Samtec on Vimeo.

The development of COM-HPC® exceeds the demand for high-speed performance in embedded computers, and provides scalability for next-gen embedded system designs. Samtec interconnects included in this standard offer 5 mm and 10 mm stack heights, a 400 pin open-pin-field on 0.635 mm pitch, BGA attach, and up to 112 Gbps PAM4 performance. Please watch the video to learn more.

Come to understand the new specification and experience the performance boost with Advantech new COM-HPC Server Module, SOM-8990 with Intel Skylake-D CPU in size E form factor!