Highlights:

• Carrier Design Guide helps hardware engineers design application-specific carrier boards for COM-HPC-based systems.
• Revision 2.2 of the Carrier Design Guide introduces new diagrams, figures, and design notes for COM-HPC Mini.
• Document contains technical materials such as interface schematics and practical guidance on design rules.

WAKEFIELD, MA. PICMG, a consortium for open hardware specifications, has released revision 2.2 of the COM-HPC Carrier Design Guide. This comprehensive document contains interface schematics, diagrams, design rules and requirements, and more for PCB layout engineers and hardware developers looking to create application-specific carrier boards that pair with COM-HPC modules.

Revision 2.2 of the Design Guide includes updates to address the new COM-HPC 2.1 specification, nicknamed COM-HPC Mini, which is the 95 mm x 60 mm platform that uses one less connector compared to its fellow COM-HPC form factors, but still delivers 400 pins for carrying high-speed signals from the processor module to carrier boards.

“Designing a carrier board can be a complex and time-consuming process, but the COM-HPC Design Guide helps streamline that process” says Peter Hunold, head of hardware engineering at Kontron Europe GmbH and editor of the COM-HPC working group. “It serves as an excellent complement to the COM-HPC base specification, as well as, for revisions like COM-HPC 2.1 that introduced the new “Mini” form factor and vendor documentation.”

What’s New in COM-HPC Carrier Design Guide Revision 2.2

Revision 2.2 of the Carrier Board Design Guide primarily focuses on the COM-HPC Mini, a small form factor expansion of the COM-HPC standard first announced in 2022. This new guide clarifies the differences between COM-HPC Client and COM-HPC Mini carrier board requirements, with examples that illustrate modifications necessary to move from Client- to Mini-compatible designs.

The Design Guide 2.2 release also introduces information on the Intel JHL9040R USB4 Retimer, which replaces the JHL8040R in Rev 2.1. In addition to updated references, the document includes Intel JHL9040R block diagrams for both COM-HPC Client and COM-HPC Mini designs.

“Designing hardware to support new and emerging workloads is becoming progressively more challenging. Open standards such as COM-HPC help businesses overcome those challenges,” says Christian Eder, director of market intelligence at congatec. “They considerably reduce time-to-market for even the most sophisticated applications, especially with documentation to streamline the design process.”

Learn More

The COM-HPC Carrier Design Guide revision 2.2 can be downloaded free of charge from PICMG’s website. For more information on the Design Guide, the COM-HPC standard, and other related specifications, visit:

• COM-HPC Design Guide Revision 2.2: https://www.picmg.org/wp-content/uploads/PICMG_COMHPC_CDG_R2_2.pdf
• COM-HPC Specification Documents: https://www.picmg.org/shop/
• COM-HPC Overview: https://www.picmg.org/openstandards/com-hpc/
• PICMG Design Guides: https://www.picmg.org/resources/design-guides/

About PICMG

Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, process control and automation, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 150 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, CompactPCI, CompactPCI Serial, MicroTCA, AdvancedMC, AdvancedTCA, InterEdge, ModBlox7, HPM (Hardware Platform Management), MicroSAM, and SHB Express. For more information, visit https://www.picmg.org.

• 30th anniversary highlighted by two new specification families and industry partnerships
• New PICMG branding on display at embedded world Hall 5, Booth 342
• Reception for PICMG members to be held on Wednesday, April 10th at Nuremberg Messe

April 8th, Nuremberg, Germany. For 30 years, PICMG has been shaping the embedded computing industry with standards. However, the organization is by no means resting on its laurels. Quite the opposite: with the ratification of two completely new standards just this year, the consortium and its members are looking forward to the next 30 years. To celebrate this milestone, PICMG is rolling out all new branding, with new logos for all related specifications, in Hall 5, booth 5-342 at this year’s embedded world in Nuremberg.

Founded in 1994, PICMG is a nonprofit consortium of companies and organizations that collaboratively develop open standards for high performance embedded computing applications used by the telecommunications, military, and industrial market sectors.

There are over 140 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, very high speed signaling design and analysis, networking expertise, backplane and packaging design, power management, High Availability software, and comprehensive system management. Over 40 members will be showcasing their products based on PICMG specifications at the 2024 Embedded World.

Some of the standards families developed under PICMG include COM-HPC, COM Express®, MicroTCA®, CompactPCI® Serial, AdvancedMC®, CompactPCI®, AdvancedTCA®, as well as the newly ratified ModBlox7 and InterEdge.

In its 30 years of operation, PICMG has published over 60 specifications developed by participants from hundreds of companies. Work across a wide range of markets, applications, and technologies continues as the boundaries of datacom, telecom, mil/aero, industrial, man machine interface applications, and deeply embedded computing blur.

Thousands of products ranging from components, subsystems, and complete application ready systems are commercially available and represent over $5B USD in yearly global revenue.

To Learn More:
Visit the “Value of Open Standards Page” here. Discover more about the open standards environment and learn how your company can participate and profit from belonging to PICMG here. Or, attend the 2024 Embedded World Exhibition & Conference to meet with PICMG representatives in person.

• PICMG website: www.picmg.org
• Embedded World 2024 website: www.embedded-world.de

About PICMG
Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high-performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 150 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, InterEdge, ModBlox7, SHB Express, MicroSAM, and HPM (Hardware Platform Management). For more information, visit https://www.picmg.org.

Highlights:

• Modular compute, switch, and I/O architecture enables interoperable standard for industrial PCs, PLCs, and distributed control systems.
• Supports IEC 61499 and IEC 61131 for compatibility with a wide range of automation systems.
• Hot-swappable modules can be replaced or upgraded while the system is running, minimizing downtime and maintenance costs.

FEBRUARY 2024 ­­– WAKEFIELD, MA. PICMG, the consortium for open hardware specifications, today announced the release of InterEdge, a modular architecture for process control systems (PCS). The IEC 61499 and IEC 61131-compatible InterEdge specification promises to revolutionize the industry with an interoperable, multi-vendor alternative to proprietary Industrial PCs (IPCs), Programmable Logic Controllers (PLCs), and Distributed Control Systems (DCSs).

“Business needs evolve at an ever-increasing rate,” said Francisco Garcia, Americas Regional Instrument Lead at ExxonMobil Technology & Engineering Company and member of the InterEdge technical working group. “InterEdge delivers an interchangeable base hardware standard for industrial manufacturers looking to adapt to changing business needs. As a result, providers can deploy and scale dedicated physical assets and focus on value-added software and services.”

A Shared Standard for the Process Industry

InterEdge defines a vendor-neutral, open standard for edge computing and I/O module hardware. It segments hardware into Compute Modules, Switch Modules, and I/O Modules. All of these modules are connected via a common backplane, enabling easy customization and expansion of industrial automation functions.

An overview of the specification and an architecture diagram are available at https://www.picmg.org/openstandards/interedge/. InterEdge 0 R1 supports both single- and multi-channel I/O implementations and a forthcoming specification will be optimized for single-channel I/O.

The full specification is available to purchase. Interested parties are encouraged to participate in ongoing specification development efforts by joining the PICMG InterEdge working group by emailing [email protected].

With its modular approach, InterEdge can flexibly incorporate the functions of disparate automation systems into a single platform. This common platform can be deployed across automation, chemical refining, oil and gas, pharmaceuticals, metals and mining, pulp and paper, food and beverage, and a wide range of other process industries.

Upgradability that Breaks Free from Hardware Lock-In
By replacing proprietary edge devices, InterEdge eliminates vendor lock-in, simplifies integration and maintenance, and enables online upgrades, all of which contribute to significant cost savings.

In the past, edge components remained in place for decades with static functional capabilities due to the difficulties of upgrades. In contrast, the hot-swappable interoperability of InterEdge allows industrial organizations to quickly adapt to changing market demands and technological advancements. Now manufacturers can improve their competitive position through emerging trends in AI, Industrial IoT, and Industry 4.0.

“InterEdge allows industrial manufacturers to transition from proprietary hardware to an open architecture where they can choose fit-for-purpose components, replace obsolete hardware, add computational resources, and upgrade hardware security in a running plant at virtually zero switching costs,” said Matt Burns, global director of technical marketing at Samtec and chair of the InterEdge Technical Working Group.

“InterEdge does for industrial control systems what the Open Compute Project did for data centers,” Burns added.

Strong Support from Industry Leaders
InterEdge originated as part of the O-PAS™ (Open Process Automation) Standard from The Open Group® Open Process Automation™ Forum (OPAF), a consortium of 110+ leaders in process automation including system suppliers, engineering firms, governmental bodies, research institutions, and end customers.

With its new home in PICMG, InterEdge joins a growing family of multi-vendor hardware standards with a decades-long track record of success. PICMG and OPAF have committed to working together to push for the same widespread adoption of InterEdge.

“PICMG felt it was critical to release this because it lays the groundwork for subsequent iterations of the InterEdge specification that will address the broadest range of industry use cases possible,” says Jessica Isquith, president of PICMG. “We are eager to support the continued progress of InterEdge and its ability to revolutionize industrial edge environments.”

Learn More

Details of the InterEdge specification are available on the PICMG website. Solutions from participating hardware vendors are expected to be available in the coming months.

For more information on InterEdge, visit:
· InterEdge Specification Overview: www.picmg.org/openstandards/interedge
· License the InterEdge Specification: www.picmg.org/product/interedge