nVent Releases Next Generation nVent SCHROFF MicroTCA.4 Crate

NEW MTCA.4 Crate achieves 128 Gbits bandwidth per slot with PCIe Gen 5
Enhanced Cooling: Improved rear card cage cooling
Future Proof: New Cooling Unit Manager design based on controller with long life cycle
Backward Compatible: Mix and match legacy and new chassis and cooling units

nVent Electric plc (NYSE:NVT) (“nVent”), a global leader in electrical connection and protection solutions, announced the launch of its first MicroTCA.4 (MTCA.4) Crate in accordance with Revision 3.0 of the MTCA.0 base standard.

In September 2023 PICMG released Revision 3.0 of the MTCA.0 specification. This revision supports PCI Express Gen 4 and PCI Express Gen 5, as well as 100GBASE-KR4, to improve system performance by 4x. To accomplish these higher data rates, SMD and compression mount connectors have been evaluated by the Next-Gen MTCA working group, and the simulation results have been taken as a base to define the whole data transmission channel for MicroTCA. The transmission channel has been divided into logical parts to define the limits for boards and backplane to ensure all MTCA.0 Rev 3.0 MCHs, AMCs and crates work together in a PCI Express Gen 4/5 or 100 GbE environment.

As these high-end switches consume more power compared to their predecessors, the power budget for the MicroTCA Carrier Hub (MCH), where the switch resides, has been upgraded from 80 W to 110 W. To prevent overheating, the cooling unit’s power budget was also upgraded to 110 W. A software mechanism helps ensure the backward compatibility of old and new MCHs, Power Modules and Cooling Units.

In the Rear Transition Module (RTM), cooling the improved 110W power limit is achieved with powerful fans and superior cooling design.

The Cooling Unit firmware performs in accordance with revision 3.0 of the MicroTCA specification. When powering up it remains in the 80 W power rating. If the Power Module supports 110 W per slot, the cooling unit will adjust accordingly. If it only supports 80 W, or if the IPMI communication gets lost, the Power Module will stay in the 80W power envelope.

The Renesas H8S controller previously used on nVent SCHROFF MTCA.4 Crates has been end of life’d (EOL’d). For this reason, nVent has introduced a new Cooling Unit Manager design based on the STM32 controller from STMicroelectronics, which includes the additional features described above.

Providing the Highest Data Bandwidth

To achieve the higher data bandwidth, the maximum trace length defined in the MTCA.0 Rev. 3.0 specification needs to be matched. Therefore, MCH slots were moved from the outside to the middle of the card cage.

Upgraded Materials

The PCB material has been upgraded to a lower loss material with SMD connectors for superior performance. For optimized routing, the physical order of the AMC modules has been changed. In the past, nVent SCHROFF MTCA.4 Crates used the physical order starting from 1 (from left to right), which has now changed to: 7-8-9-10-11-12-MCH1-MCH2-6-5-4-3-2-1.

About nVent

nVent is a leading global provider of electrical connection and protection solutions. We believe our inventive electrical solutions enable safer systems and ensure a more secure world. We design, manufacture, market, install and service high-performance products and solutions that connect and protect some of the world’s most sensitive equipment, buildings and critical processes. We offer a comprehensive range of system protection and electrical connection solutions across industry-leading brands that are recognized globally for quality, reliability, and innovation. Our principal office is in London, and our management office in the United States is in Minneapolis. Our robust portfolio of leading electrical product brands dates back more than 100 years and includes nVent CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE. Learn more at www.nvent.com.

nVent, CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE are trademarks owned or licensed by nVent Services GmbH or its affiliates.

Press Contacts:
Christian Ganninger
Product Marketing Manager
nVent Electric plc
[email protected]

Christopher Smerillo
Product Manager
nVent Electric plc
[email protected]

April 10, 2025

The best parts of Cloud-computing

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March 7, 2025

CompactPCI Serial R3: PICMG announces release of new specification

With Release 3 of the CompactPCI Serial specification, PICMG doubles the bandwidth and speed of CompactPCI Serial applications. This benefits sectors such as aerospace, industry and automotive.

Wakefield, MA. March 11, 2025. PICMG – a leading consortium to develop innovative open standards in embedded computing – today announces the release of CompactPCI Serial^® Revision 3 (CPCI-S.0 R3.0). With the third revision of the standard, the organization is ensuring future viability and scalability for many years to come. CompactPCI Serial^® was originally developed as an extension of the open CompactPCI^® standard to meet the demand for robust, modular and powerful computer systems in industrial and embedded applications. The combination of high performance, modularity and robustness has made CompactPCI Serial^® a popular standard for industrial applications, automation, and much more – where robustness, interoperability and use in harsh environments with comprehensive connectivity are crucial.

CompactPCI supports serial data transfer rates via PCI Express, USB, and Ethernet, a robust design with AirMax connectors and full interchangeability with CompactPCI cards via 3U/6U slot card systems. Developers can look forward to the completely new opportunities offered by revision 3 compared to revision 2, which are among others:

Full PCI Express (PCIe) support: While R2 supported PCI Express up to Gen3 with 8 GT/s, R3 extends support to PCI Express Gen4 with 16 GT/s, which means increasing speed by doubling the data rate.
USB support: USB interface support has been increased from USB 3.0 (Gen1) with 5 Gb/s in R2 to USB 3.1 (Gen2) with 10 Gb/s in R3, doubling the bandwidth.
Ethernet: R3 introduces support for 10GBASE-T and 10GBASE-KR Ethernet, enabling higher bandwidth network speeds.
Connectors: In order to realize these higher data rates, new AirMax VSe^® high-speed connectors for CPU boards are used in R3 instead of AirMax VS^® in Release 2. These connectors are fully upwards and downwards compatible.

“I am very proud that with Revision 3 of the specification, we have managed to provide all embedded integrators with better CompactPCI Serial performance. Developers can look forward to better connectivity, higher performance and much better scalability,” said Jess Isquith, President of PICMG.

The CompactPCI specification defines a modular computer system, consisting of a backplane, a system slot, and up to 24 peripheral boards. The mechanical design is fully backward compatible to CompactPCI^® and will interoperate with existing systems. A system slot board can be used in a peripheral slot as well to do multiprocessing. The easiest way to communicate in this case is via Ethernet. Ethernet uses cable standards ‘xxBase-T’ instead of dedicated backplane standards. This lowers the cost, guarantees better interoperability and offers currently up to 10 Gb/s data throughput. Plus, implementation of the Ethernet connection of a system board can be done with a mezzanine board (3U or 6U). Due to this concept, more flexibility will be achieved, because the usage of Ethernet does not depend on the system board itself.

CompactPCI Serial can be combined with existing CompactPCI boards by using a CompactPCI PlusIO system slot card. These hybrid systems offer an ideal migration path from parallel to serial connections. CompactPCI Serial for Space specifically addresses the extreme environment requirements for outer space. Developers who want to build applications for harsh environments in industry, aviation or more can now download the new specification from the PICMG website and start designing immediately. PICMG member companies are also already working on their first products based on the new specification. The release of revision 4 is even in preparation.

PICMG at embedded world:

Hall 5, booth 320A

Additional material can be found here: https://www.picmg.org/openstandards/compactpci-serial/

Revision 3 of CompactPCI Serial can be downloaded here:

https://www.picmg.org/product/compactpciserial-specification-r3/

About PICMG

Founded in 1994, PICMG (PCI Industrial Computer Manufacturers Group) is a nonprofit consortium of companies and organizations that collaboratively develop open standards for high performance telecommunications, military, industrial, and general purpose embedded computing applications. Its original mission was to extend the PCI standard to non-desktop applications. There are over 140 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, very high speed signaling design and analysis, networking expertise, backplane and packaging design, power management, High Availability software, and comprehensive system management. Equipment built to PICMG standards is used worldwide and anyone can build or use equipment without restriction (although certain technologies used for some military applications may be subject to U.S. export restrictions governed by ITAR rules). Key standards families developed by PICMG include CompactPCI®, AdvancedTCA®, MicroTCA®, AdvancedMC®, CompactPCI® Serial, COM Express®, SHB Express®, MicroSAM, COM-HPC. and HPM (Hardware Platform Management).

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