2162854  01.07.2025 CET/CEST

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Jun 11, 2025, 10:00 AM ET

ESM-HRPL to Power Next-Gen Edge AI and Industrial Computing

TAIPEI, TAIWAN, June 11, 2025 /EINPresswire.com/ — Avalue Technology Inc. (TPEx: 3479.TWO), a global leader in industrial computing solutions, today announced the release of its next-generation COM-HPC module, ESM-HRPL, along with the high-performance carrier board EEV-HC10. Designed for compute-intensive edge applications such as AI inference, smart healthcare, industrial automation, and intelligent energy systems, this solution delivers exceptional performance, modular scalability, and long-term product availability.

Redefining Edge Architecture with Advanced COM-HPC Performance
Compliant with PICMG^® COM-HPC^® Client Type specification, ESM-HRPL supports Intel^® 12th/13th/14th Gen Core™ processors (LGA 1700, up to 65W TDP) and integrates the Intel^® R680E chipset. The module features four DDR5 SO-DIMM sockets, supporting up to 128GB memory at max 3600MT/s bandwidth and optional ECC (depending on selected CPU). Equipped with a high-density I/O interface, ESM-HRPL offers PCIe Gen5, dual 2.5GbE (Intel^® i226-LM), USB 3.2 Gen2x2, eDP, and three DDI interfaces, ensuring seamless support for high-speed data throughput and multi-device integration. The modular architecture significantly reduces development time across platforms, allowing customers to accelerate time-to-market while retaining proprietary application knowledge via customized carrier board designs—enhancing system security and solution differentiation.

EEV-HC10 Carrier Board Delivers Versatile Expansion for AIoT Integration
Paired with ESM-HRPL, the EEV-HC10 carrier board—built on a standard EATX form factor (305 x 330mm) and compliant with COM-HPC Rev. 1.2—features up to four IET (Interface Expansion Technology) slots for modular upgrades such as display outputs, USB communication, and 2.5G. It also provides one PCIe Gen5 x16 slot, multiple PCIe x4/x1 slots, and supports high-speed expansion for AI accelerators, GPUs, and other edge computing peripherals. In addition to rich PCIe connectivity, EEV-HC10 supports HDMI/DP/eDP display outputs, USB Type-C, RS-232, GPIO, and other essential industrial I/O interfaces—delivering exceptional deployment flexibility for AIoT systems in diverse verticals.

Purpose-Built for Demanding Edge AI Applications
Engineered to address the demands of high-throughput and low-latency processing at the edge, ESM-HRPL is ideal for scenarios such as medical imaging, real-time AI inference, and smart grid management. Its multi-channel video output and robust data transmission capabilities support advanced diagnostics like MRI and CT scanning. In edge AI environments, ESM-HRPL’s powerful CPU and scalable PCIe architecture ensures seamless integration of GPUs and AI accelerators, expediting model inference and decision-making. In energy and utility applications, its reliable I/O and edge processing capabilities enable rapid system response and efficient remote control.

Avalue’s innovative semi-modular thermal solution, featuring a copper heat spreader and swappable heatsink design, allows flexible cooling configurations based on CPU TDP—ensuring optimal thermal management and platform compatibility. Combined with structural flexibility, hardware-level security, and professional ODM carrier board services, ESM-HRPL is uniquely positioned to deliver value in high-end embedded deployments.

Long-Term Support and Complete Engineering Assistance
Built on Intel’s long-life platform roadmap, Avalue’s COM-HPC modules offers longevity support, meeting the needs of industrial, healthcare, and infrastructure deployments. The ESM-HRPL module supports Windows 11 LTSC and a range of mainstream Linux distributions, with full access to documentation, development guides, and user manuals. Supported by local engineering expertise and responsive service, Avalue empowers businesses to streamline system integration and accelerate time-to-market with confidence.

To learn more, please visit www.avalue.com or contact us via our online contact form.

About Avalue Technology
Avalue Technology was founded in 2000 and is a global leader in industrial computer solutions. Avalue Technology has a proven track record of success in the industrial control industry, and we leverage that experience to provide reliable and trustworthy customized products and services. Our primary products are embedded and industrial computer solutions, with a focus on smart healthcare, smart manufacturing, smart transportation, smart retail, and Internet of Things (IoT) applications. Avalue is committed to the sustainable growth of our company. We are guided by the business philosophy of “stability, innovation, diligence, and enthusiasm, and enjoyment of work and life.” We are dedicated to leveraging the power of intelligence and sustainability to disrupt the future of digital blueprints and to drive positive, long-term change in the smart industry.

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Designed for next-generation edge and telecommunications infrastructure, the new standard’s architecture addresses quantum computing, 6G connectivity, and high-density AI workloads.

Wakefield, MA. March 11, 2025. PICMG — a leading consortium developing innovative open standards for embedded computing — has officially ratified the 400G AdvancedTCA (ATCA) modular computing standard. Developed collaboratively by industry leaders including Comtel, TE Connectivity, and Vodatech, the new standard is built to meet the escalating demands of sophisticated edge, AI, and quantum deployment.

According to Alexei Volkov, CTO at Comtel and PICMG Working Group Chair, this release bridges the gap between cloud-scale virtualization and edge physical layer requirements while at the same time demonstrating the standard’s enduring versatility. It improves upon previous generations in several ways:

• 400G Backplane Connectivity: While older generations were capped at 25Gbps, TE Connectivity EZD++ connectors support 32Gbps/ch via PAM-4, a significant increase in bandwidth.
• Streamlined Compliance: Rather than relying on physical test cards, 400G ACTA introduces S-parameter modeling, enabling virtual validation of signal integrity across worst-case backplane/card combinations.
• Enhanced Thermal Management: Validated 1kW+ liquid cooling supports deployment in coastal RF sites and desert environments, something challenging with comparatively limited 650W/slot air cooling.
• Full Backwards Compatibility: Mechanically identical connectors ensure full backwards compatibility with all PICMG 3.1-3.7 specifications.
• Increased Power Density: The new standard features dual-slot blade, with 800W/slot for Xilinx Versal HBM. It also supports 32-port 400G blades with Xilinx Versal HBM FPGAs.

ACTA platforms have long played a critical role in telecommunications infrastructure, with industry leaders such as Nokia extensively utilizing the technology. He expects the company will benefit considerably from 400G ACTA’s improvements, especially if integrating it with Open RAN technology. He was also quick to note that ACTA’s relevance extends far beyond telecommunications.

“Around 80% of our use cases for ACTA are now outside the telecom space,” Volkov explained. “We now have projects like quantum computing equipment for the defense sector, radio telescope control at the Atacama Observatory, and semiconductor equipment for leading EU foundries. This is a significant shift, and one we expect to continue with the release of 400G ACTA.”

“ACTA’s modular architecture is also used extensively in edge security,” he added. “Fortinet’s terabit firewall systems, for example, rely heavily on the technology.”

Specification documents for 400G ACTA will be made available to PICMG members this month, and TE Connectivity plans to release compliance test suites in Q2 2025. ANSYSS HFSS capability has also been confirmed, with a developer workshop scheduled from June 15-17 in Berlin for training. A second workshop will take place in San Diego from July 22-24.

“This isn’t just about speed,” said Volkov. “It’s about preserving over 25 years of ACTA ecosystem investment while also meeting quantum computing and 6G timing requirements. Our field deployments from Chilean deserts to German clean rooms prove modular architectures outlast conventional servers in critical infrastructure.”

The first compliant 400G ACTA systems are expected to ship in Q4 2025. PICMG also has several additional specification updates planned for 2026, including Redfish management integration, SOSA-aligned configuration, and additional edge-to-core orchestration capabilities.

About PICMG
Founded in 1994, PICMG (PCI Industrial Computer Manufacturers Group) is a nonprofit consortium of companies and organizations that collaboratively develop open standards for high performance telecommunications, military, industrial, and general purpose embedded computing applications. Its original mission was to extend the PCI standard to non-desktop applications. There are over 140 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, very high speed signaling design and analysis, networking expertise, backplane and packaging design, power management, High Availability software, and comprehensive system management. Equipment built to PICMG standards is used worldwide and anyone can build or use equipment without restriction (although certain technologies used for some military applications may be subject to U.S. export restrictions governed by ITAR rules). Key standards families developed by PICMG include ®, AdvancedTCA®, MicroTCA®, AdvancedMC®, CompactPCI® Serial, COM Express®, SHB Express®, MicroSAM, COM-HPC. and HPM (Hardware Platform Management).