Samtec offers a high-density interconnect system that meets the COM-HPC® standard for high-performance Computer-On-Modules. COM-HPC® meets the growing demands for embedded systems to provide ultra-high speed performance and extended connectivity with limitless scalability.
Key Features:
– High-performance, flexible open-pin-field array
– High-speed PCIe® 5.0 and 100 Gb Ethernet capable
– 400 pin BGA mount
– 4 rows x 100 columns
– 2.2 / 2.4 / 2.2 mm row pitch
– 0.635 mm pitch
– 5 mm or 10 mm stack heights
– Dimensions: 68.62 mm x 9 mm x stack height
– Up to 360 W at 11.4 – 12.6 Volts
Ordering Information:
– Module Receptacle J1/J2 – Samtec P/N ASP-209946-01
– Carrier Plug P1, P2 (5 mm Stack) – Samtec P/N ASP-214802-01
– Carrier Plug P1, P2 (10 mm Stack) – Samtec P/N ASP-209948-01
