JOIN

New Member Press Releases

logo

ARBOR Technology Unveils COMX-A300: High-Performance COM-HPC Module Powered by Intel Core Ultra Processors

November 4, 2025

News provided by ARBOR Technology Nov 04, 2025, 08:00 ET TAIPEI, Nov. 4, 2025 /PRNewswire/ — ARBOR Technology, a leading provider of embedded and industrial computing solutions, proudly [...]

Read More
logo

congatec acquires majority stake in Kontron subsidiary JUMPtec

July 1, 2025

01.07.2025 / 07:00 CET/CEST The issuer is solely responsible for the content of this announcement. congatec becomes 96% shareholder in JUMPtec GmbH by means of a capital increase and acquires [...]

Read More
logo

Avalue Introduces High-Performance COM-HPC Module

June 11, 2025

News provided by EIN Presswire Jun 11, 2025, 10:00 AM ET ESM-HRPL to Power Next-Gen Edge AI and Industrial Computing TAIPEI, TAIWAN, June 11, 2025 /EINPresswire.com/ — Avalue [...]

Read More
logo

Tria to launch five new product families powered by Qualcomm at Embedded World

March 5, 2025

Tria Technologies, an Avnet company specializing in embedded compute boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon platforms at its Embedded World [...]

Read More
logo

Exciting Embedded World News (And More)

April 8, 2024

More than 45 PICMG members will be exhibiting at Embedded World 2024. For the first time at the world’s largest trade fair dedicated to embedded technology, PICMG is the subject […]

Read More

Member Press Releases

Member Press Releases Archive

June 29, 2022 Avnet Embedded presents COM-HPC modules based on 12th Gen Intel® Core™ processors for high-performance computing
June 29, 2022 congatec launches five new COM-HPC Server Size D modules with Intel Xeon D-2700 processors following the “less is more” approach
June 26, 2022 congatec extends its 12th Gen Intel Core processor based COM-HPC and COM Express Computer-on-Module portfolio with seven more power-efficient new processor variants
May 29, 2022 Kontron’s COMh-ccAS delivers higher graphics and computing performance for IoT applications
May 10, 2022 Kontron’s COMh-ccAS delivers higher graphics and computing performance for IoT applications
April 15, 2022 New Kontron COM-HPC® Server Module with Intel Xeon D-2700 processor family for high-end Edge Computing
Default Image April 8, 2022 ADLINK’s Ampere® Altra® Developer Platform with Arm SystemReady certification
January 5, 2022 ADLINK launches COM-HPC Client Type and COM Express Type 6 Modules with 12th Gen Intel® Core™ processors
January 5, 2022 congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors
August 10, 2021 EKF Announces SRS-1201-BLUBRICK CompactPCI® Serial • Rugged Wall-Mount Box
August 3, 2021 congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen Intel Core processors (formerly codenamed: Tiger Lake-H)
August 3, 2021 Avnet Embedded announces high-performance COM Express™ module family based on 11th Gen. Intel® Core™ H-Series processors for IoT and AI industrial products
August 3, 2021 -ADLINK Launches First COM Express Module Featuring Intel® Core™, Xeon® and Celeron® 6000 processors
August 3, 2021 Samtec Releases Family of AcceleRate® HP High-Performance Arrays
July 13, 2021 Portwell Announces New COM Express® Type 10 Mini Module with the Latest Intel Atom® x6000E Series Processor
1 2 3 4 … 17

PICMG is a consortium of companies who collaboratively develop open standards for high performance telecommunications and industrial computing applications.

©2026 PICMG. All Rights Reserved.

Join Mailing List