New Member Press Releases
PICMG Forms Technical Working Groups on Two Specifications: COM-HPC 1.4 and metaHPM
September 23, 2026
–Leading open standards organization invites participation in latest specifications for high-performance computing and for hardware platform management; exhibits at MOSA Summit 2026 [...]
ARBOR Technology Unveils COMX-A300: High-Performance COM-HPC Module Powered by Intel Core Ultra Processors
November 4, 2025
News provided by ARBOR Technology Nov 04, 2025, 08:00 ET TAIPEI, Nov. 4, 2025 /PRNewswire/ — ARBOR Technology, a leading provider of embedded and industrial computing solutions, proudly [...]
congatec acquires majority stake in Kontron subsidiary JUMPtec
July 1, 2025
01.07.2025 / 07:00 CET/CEST The issuer is solely responsible for the content of this announcement. congatec becomes 96% shareholder in JUMPtec GmbH by means of a capital increase and acquires [...]
Avalue Introduces High-Performance COM-HPC Module
June 11, 2025
News provided by EIN Presswire Jun 11, 2025, 10:00 AM ET ESM-HRPL to Power Next-Gen Edge AI and Industrial Computing TAIPEI, TAIWAN, June 11, 2025 /EINPresswire.com/ — Avalue [...]
Tria to launch five new product families powered by Qualcomm at Embedded World
March 5, 2025
Tria Technologies, an Avnet company specializing in embedded compute boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon platforms at its Embedded World [...]
